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公开(公告)号：US09196554B2
公开(公告)日：2015-11-24
申请号：US14043185
申请日：2013-10-01
发明人： Ralf Otremba , Josef Höglauer , Jürgen Schredl , Xaver Schlögel , Klaus Schiess
IPC分类号： H01L23/48 , H01L23/13 , H01L23/00 , H01L25/065
CPC分类号： H01L23/13 , H01L23/48 , H01L23/5383 , H01L23/5385 , H01L23/5389 , H01L24/83 , H01L25/065 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.
摘要翻译： 电子部件包括至少一个半导体器件和包含至少两个非导电层和导电再分布结构的再分布板。 半导体器件嵌入在再分布板中并电耦合到再分配结构，并且再分布板具有带有台阶的侧面。 再分配结构的外部接触垫布置在台阶上。
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公开(公告)号：US10109609B2
公开(公告)日：2018-10-23
申请号：US14153755
申请日：2014-01-13
发明人： Ralf Otremba , Josef Höglauer , Jürgen Schredl , Xaver Schlögel , Klaus Schiess
IPC分类号： H01L23/00 , H01L23/556 , H01L23/552
摘要： A connection structure is provided that includes a semiconductor substrate, a first layer arranged on the semiconductor substrate, the first layer being configured to provide shielding against radioactive rays, a second layer arranged on the first layer, the second layer including solder including Pb, and an electrically conductive member arranged on the second layer.
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公开(公告)号：US20150200178A1
公开(公告)日：2015-07-16
申请号：US14153755
申请日：2014-01-13
发明人： Ralf Otremba , Josef Höglauer , Jürgen Schredl , Xaver Schlögel , Klaus Schiess
IPC分类号： H01L23/00 , H01L23/556
CPC分类号： H01L24/29 , H01L23/552 , H01L23/556 , H01L24/32 , H01L24/37 , H01L24/40 , H01L2224/04026 , H01L2224/04034 , H01L2224/29083 , H01L2224/29116 , H01L2224/32245 , H01L2224/33181 , H01L2224/37147 , H01L2224/40245 , H01L2224/48247 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/01103 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要： A connection structure is provided that includes a semiconductor substrate, a first layer arranged on the semiconductor substrate, the first layer being configured to provide shielding against radioactive rays, a second layer arranged on the first layer, the second layer including solder including Pb, and an electrically conductive member arranged on the second layer.
摘要翻译： 提供了一种连接结构，其包括半导体衬底，布置在半导体衬底上的第一层，第一层被配置为提供屏蔽防放射线，第二层布置在第一层上，第二层包括包含Pb的焊料，以及 布置在第二层上的导电构件。
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公开(公告)号：US20140264944A1
公开(公告)日：2014-09-18
申请号：US13803255
申请日：2013-03-14
CPC分类号： H01L23/28 , H01L23/3107 , H01L23/3135 , H01L23/36 , H01L23/4093 , H01L23/48 , H01L23/49562 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/84 , H01L24/85 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/40247 , H01L2224/45014 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2224/45099 , H01L2224/37099
摘要： A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound encapsulates the die, the connector, at least part of the base, and part of the lead, so that the lead extends outward from the mold compound. An electrical insulation layer separate from the mold compound is attached to a surface of the mold compound over the connector. The electrical insulation layer has a fixed, defined thickness so that the package has a guaranteed minimum spacing between an apex of the connector and a surface of the electrical insulation layer facing away from the connector.
摘要翻译： 半导体封装包括基座，附接到基座的芯片，引线和将引线电连接到管芯的连接器。 模具化合物封装模具，连接器，基底的至少一部分和引线的一部分，使得引线从模具化合物向外延伸。 与模具化合物分离的电绝缘层通过连接器附着在模具化合物的表面上。 电绝缘层具有固定的限定厚度，使得封装在连接器的顶点与背离连接器的电绝缘层的表面之间具有有保证的最小间隔。
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公开(公告)号：US09099391B2
公开(公告)日：2015-08-04
申请号：US13803255
申请日：2013-03-14
CPC分类号： H01L23/28 , H01L23/3107 , H01L23/3135 , H01L23/36 , H01L23/4093 , H01L23/48 , H01L23/49562 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/84 , H01L24/85 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/40247 , H01L2224/45014 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2224/45099 , H01L2224/37099
摘要： A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound encapsulates the die, the connector, at least part of the base, and part of the lead, so that the lead extends outward from the mold compound. An electrical insulation layer separate from the mold compound is attached to a surface of the mold compound over the connector. The electrical insulation layer has a fixed, defined thickness so that the package has a guaranteed minimum spacing between an apex of the connector and a surface of the electrical insulation layer facing away from the connector.
摘要翻译： 半导体封装包括基座，附接到基座的芯片，引线和将引线电连接到管芯的连接器。 模具化合物封装模具，连接器，基底的至少一部分和引线的一部分，使得引线从模具化合物向外延伸。 与模具化合物分离的电绝缘层通过连接器附着在模具化合物的表面上。 电绝缘层具有固定的限定厚度，使得封装在连接器的顶点与背离连接器的电绝缘层的表面之间具有有保证的最小间隔。
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公开(公告)号：US20150091176A1
公开(公告)日：2015-04-02
申请号：US14043185
申请日：2013-10-01
发明人： Ralf Otremba , Josef Höglauer , Jürgen Schredl , Xaver Schlögel , Klaus Schiess
IPC分类号： H01L23/13 , H01L23/48 , H01L25/065 , H01L23/00
CPC分类号： H01L23/13 , H01L23/48 , H01L23/5383 , H01L23/5385 , H01L23/5389 , H01L24/83 , H01L25/065 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.
摘要翻译： 电子部件包括至少一个半导体器件和包含至少两个非导电层和导电再分布结构的再分布板。 半导体器件嵌入在再分布板中并电耦合到再分配结构，并且再分布板具有带有台阶的侧面。 再分配结构的外部接触垫布置在台阶上。
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