Invention Application
- Patent Title: CHEMICAL MECHANICAL POLISHING COMPOSITION FOR POLISHING SILICON WAFERS AND RELATED METHODS
- Patent Title (中): 抛光硅膜的化学机械抛光组合物及相关方法
-
Application No.: US14039390Application Date: 2013-09-27
-
Publication No.: US20150093900A1Publication Date: 2015-04-02
- Inventor: Yasuyuki Itai , Naresh Kumar Penta , Naoko Kawai , Hiroyuki Nakano , Shinichi Haba , Yoshiharu Ota , Takayuki Matsushita , Masashi Teramoto , Sakiko Nakashima , Tomoyuki Toda , Koichi Yoshida , Lee Melbourne Cook
- Applicant: Nitta Haas Incorporated , Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306
Abstract:
A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.
Public/Granted literature
- US09150759B2 Chemical mechanical polishing composition for polishing silicon wafers and related methods Public/Granted day:2015-10-06
Information query
