发明申请
- 专利标题： SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES
- 专利标题（中）： 具有独立驱动的半导体封装设备
-
申请号： US14399495申请日： 2012-05-07
-
公开(公告)号： US20150115479A1公开(公告)日： 2015-04-30
- 发明人: Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
- 申请人： Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
- 申请人地址： CN Shanghai CN Shanghai
- 专利权人： SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.,SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- 当前专利权人： SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.,SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- 当前专利权人地址： CN Shanghai CN Shanghai
- 国际申请： PCT/CN2012/075126 WO 20120507
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L21/56
摘要：
A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
公开/授权文献
- US09331045B2 Semiconductor die laminating device with independent drives 公开/授权日：2016-05-03