Invention Application
- Patent Title: CMP APPARATUS
- Patent Title (中): CMP装置
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Application No.: US14405116Application Date: 2012-06-07
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Publication No.: US20150140900A1Publication Date: 2015-05-21
- Inventor: Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
- Applicant: Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
- Applicant Address: KR Suwon-si KR Osan-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,EHWA DIAMOND INDUSTRIAL CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,EHWA DIAMOND INDUSTRIAL CO., LTD.
- Current Assignee Address: KR Suwon-si KR Osan-si
- International Application: PCT/KR2012/004502 WO 20120607
- Main IPC: B24B49/18
- IPC: B24B49/18 ; B24B53/017 ; B24B37/005

Abstract:
Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.
Public/Granted literature
- US09421668B2 CMP apparatus Public/Granted day:2016-08-23
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