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    Saw blade for preventing undercut
    2.
    发明授权
    Saw blade for preventing undercut 失效
    用于防止底切的锯片

    公开(公告)号：US06478021B1

    公开(公告)日：2002-11-12

    申请号：US09714415

    申请日：2000-11-16

    申请人： Youn Chul Kim ,  So Young Yoon

    发明人： Youn Chul Kim ,  So Young Yoon

    IPC分类号： B28D104

    CPC分类号： B28D1/121 ,  B23D61/021 ,  B24D5/06

    摘要： The present invention relates to a saw blade for preventing undercut wherein out of the sludge discharging slots arranged together with undercutting segments and ordinary cutting segments on the circumference of a steel wheel, those slots located behind the undercutting segments are dimensioned larger or wider than the slots behind the ordinary cutting segments in order to prevent the breakage and falling-off of the undercut preventing segments and ordinary cutting segments. Thus, according to the invention, there is provided a saw blade including a steel wheel, and on the circumference of said steel wheel, plural ordinary cutting segments and undercut preventing segments, two or more segments of one type being arranged alternately with one or more segments of the other type, characterized in that at the rear faces of respective ordinary cutting segments narrow slots with a predetermined narrow clearance n are formed for minor discharge of cut sludge and at the rear faces of respective undercut preventing segments wide slots with a larger clearance w than the narrow slots are formed for major discharge of cut sludge, the directions being based on the rotation of the blade wheel.

    摘要翻译： 本发明涉及一种用于防止底切的锯片，其中在与钢轮的圆周上设置有底切段和普通切割段的污泥排放槽之中，位于底切段后面的那些槽的尺寸尺寸比槽 在普通切割段之后，以防止防切割段和普通切割段的断裂和脱落。 因此，根据本发明，提供了一种包括钢轮的锯片，并且在所述钢轮的圆周上具有多个普通切割段和防切割段，一个类型的两个或多个段交替地布置有一个或多个 其特征在于，在相应的普通切割段的后表面处形成具有预定的窄间隙n的窄槽，用于少量排出切割污泥，并且在各个防切割部分的后表面处形成具有较大间隙的宽槽 w形成用于切割污泥的主要排出的窄槽，其方向基于叶轮的旋转。

    CMP APPARATUS
    3.
    发明申请
    CMP APPARATUS 有权
    CMP装置

    公开(公告)号：US20150140900A1

    公开(公告)日：2015-05-21

    申请号：US14405116

    申请日：2012-06-07

    申请人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

    发明人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

    IPC分类号： B24B49/18 ,  B24B53/017 ,  B24B37/005

    CPC分类号： B24B49/186 ,  B24B37/005 ,  B24B49/18 ,  B24B53/017

    摘要： Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

    摘要翻译： 提供了一种化学机械抛光（CMP）装置，其包括摆动单元，该摆动单元以预定间隔安装在其上放置待调理的CMP垫的压板上，安装在摆动单元的上端的连接器 在摆动单元的垂直方向上的端部，并且围绕摆放单元围绕CMP垫旋转，可旋转地安装在连接器的另一端上的旋转器，耦合到旋转体并在旋转时调节CMP垫的CMP垫调节器，以及 安装在连接器上并检测振动以测量CMP垫调节器的振动加速度的振动计，从而基于振动加速度和CMP垫调节器的安装或使用状态来预测CMP垫的磨损率。

    CONDITIONER FOR SOFT PAD AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    CONDITIONER FOR SOFT PAD AND METHOD FOR MANUFACTURING SAME 审中-公开
    用于软垫的调节器及其制造方法

    公开(公告)号：US20130344779A1

    公开(公告)日：2013-12-26

    申请号：US14003493

    申请日：2012-03-07

    申请人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jong Jae Lee

    发明人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jong Jae Lee

    IPC分类号： B24B53/017 ,  B24D18/00

    CPC分类号： B24B53/017 ,  B24D18/00

    摘要： The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a soft pad, and a method of manufacturing the same, wherein the conditioner can be used under CMP conditions using a slurry having a small amount of polishing particles, and/or a porous pad having comparatively low hardness and very high porosity.

    摘要翻译： 本发明涉及一种用于化学机械平面化（CMP）焊盘的调节器，其用于作为半导体元件制造工艺的一部分的CMP工艺中，更具体地，涉及一种用于软焊盘的调节器，以及一种方法 的制造方法，其中可以使用具有少量抛光颗粒的浆料在CMP条件下使用调理剂，和/或具有相对低的硬度和非常高的孔隙率的多孔垫。

    CMP apparatus
    5.
    发明授权
    CMP apparatus 有权
    CMP装置

    公开(公告)号：US09421668B2

    公开(公告)日：2016-08-23

    申请号：US14405116

    申请日：2012-06-07

    申请人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

    发明人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

    IPC分类号： B24B37/00 ,  B24B49/18 ,  B24B37/005 ,  B24B53/017

    CPC分类号： B24B49/186 ,  B24B37/005 ,  B24B49/18 ,  B24B53/017

    摘要： Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

    摘要翻译： 提供了一种化学机械抛光（CMP）装置，其包括摆动单元，该摆动单元以预定间隔安装在其上放置待调理的CMP垫的压板上，安装在摆动单元的上端的连接器 在摆动单元的垂直方向上的端部，并且围绕摆放单元围绕CMP垫旋转，可旋转地安装在连接器的另一端上的旋转器，耦合到旋转体并在旋转时调节CMP垫的CMP垫调节器，以及 安装在连接器上并检测振动以测量CMP垫调节器的振动加速度的振动计，从而基于振动加速度和CMP垫调节器的安装或使用状态来预测CMP垫的磨损率。

    CMP pad conditioner, and method for producing the CMP pad conditioner
    6.
    发明授权
    CMP pad conditioner, and method for producing the CMP pad conditioner 有权
    CMP垫调节剂及其制造方法

    公开(公告)号：US09314901B2

    公开(公告)日：2016-04-19

    申请号：US14117936

    申请日：2012-05-15

    申请人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

    发明人： Seh Kwang Lee ,  Youn Chul Kim ,  Joo Han Lee ,  Jae Kwang Choi ,  Jae Phil Boo

    IPC分类号： B24B53/017 ,  B24B53/02 ,  B24D18/00

    CPC分类号： B24B53/017 ,  B24D18/00

    摘要： This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.

    摘要翻译： 本发明涉及一种用于CMP（化学机械抛光）焊盘的调节器，其用于作为半导体器件的制造的一部分的CMP工艺中，更具体地，涉及一种CMP焊盘调节器，其中切割结构 即使使用不同种类的浆料和调节剂的压力变化时，抛光垫的磨损变化也不是很大，而且制造方法也是如此。

    Diamond saw blade equipped with undercut preventing tip
    8.
    发明授权
    Diamond saw blade equipped with undercut preventing tip 失效
    金刚石锯片配有防切削尖端

    公开(公告)号：US06638153B2

    公开(公告)日：2003-10-28

    申请号：US09887216

    申请日：2001-06-22

    申请人： Chang Hyun Lee ,  Youn Chul Kim

    发明人： Chang Hyun Lee ,  Youn Chul Kim

    IPC分类号： B23F2103

    CPC分类号： B24D18/0009 ,  B24D3/06 ,  B24D5/123 ,  B28D1/121

    摘要： The invention relates to a diamond saw blade which is made by attaching improved undercut preventing tips, produced by diffusing and joining cobalt-based powder onto ultra hard tips at a high temperature, to respective shank slot walls formed on the circumference of a diamond saw blade by means of laser welding in order to remove drawbacks of high cost or insecurity with the conventional art. According to the present invention, there is proposed a diamond saw blade with a shank, and with plural diamond tips provided on the circumference of the shank at a finite interval, slots for discharging cut chips being positioned between the adjoining diamond tips, further comprising undercut preventing tips disposed on respective walls of said slots, said undercut preventing tips including tungsten-carbide-based ultra hard tips provided with cobalt-based layer, wherein said undercut preventing tips are formed by diffusing and joining the cobalt-based powder to said ultra hard tips at a high temperature and said undercut preventing tips are fixed on respective walls of said slots by means of laser welding.

    摘要翻译： 本发明涉及一种金刚石锯片，该金刚石锯片通过将改进的防切削尖端附着在金刚石锯片的圆周上的相应的柄槽壁上，将尖端扩散并将钴基粉末在高温下连接到超硬尖端上而制成 通过激光焊接，以消除常规技术的高成本或不安全的缺点。根据本发明，提出了一种具有柄的金刚石锯片，并且在柄的圆周上设置有多个金刚石尖端， 有限间隔，用于将切割的芯片放置在相邻的金刚石尖端之间的槽，还包括设置在所述槽的相应壁上的防切削尖端，所述底切防止端头包括提供有钴基层的基于碳化钨的超硬尖端， 其特征在于，所述防止底切的尖端通过以高温度扩散并连接到所述超硬尖端而形成 并且所述防切削尖端通过激光焊接固定在所述槽的相应壁上。