A driver device has a semiconductor module in which a motor terminal extends from a molded body and is connected to a motor wire. A heat sink of the driver device has a module mounting surface, which extends axially outward from an axial end of the motor section, on which the semiconductor module is fastened. The motor terminal includes a base region on a molded body side of a bend location and an extension region on a tip side of the bend location. The extension region has a connection portion on which an insertion hole receives the motor wire. A terminal angle between the extension region and a perpendicular line perpendicular to the motor wire is greater than zero degree. As such, the volume of the driver device is reduced.