公开(公告)号：US20150155763A1

公开(公告)日：2015-06-04

申请号：US14553061

申请日：2014-11-25

Applicant: DENSO CORPORATION

Inventor： Mikihiro HIRAMINE ,  Masashi YAMASAKI ,  Toshihiro FUJITA

IPC: H02K11/00

CPC classification number: H02K5/225 ,  H02K3/50 ,  H02K5/22 ,  H02K11/048 ,  H02K11/33 ,  H02K11/38 ,  H02K2213/03

Abstract: A driver device has a semiconductor module in which a motor terminal extends from a molded body and is connected to a motor wire. A heat sink of the driver device has a module mounting surface, which extends axially outward from an axial end of the motor section, on which the semiconductor module is fastened. The motor terminal includes a base region on a molded body side of a bend location and an extension region on a tip side of the bend location. The extension region has a connection portion on which an insertion hole receives the motor wire. A terminal angle between the extension region and a perpendicular line perpendicular to the motor wire is greater than zero degree. As such, the volume of the driver device is reduced.

Abstract translation: 驱动器装置具有半导体模块，其中电动机端子从成型体延伸并连接到电动机线。 驱动器装置的散热器具有模块安装表面，其从电动机部分的轴向端部轴向向外延伸，半导体模块紧固在其上。 电动机端子包括弯曲位置的成型体侧的基部区域和弯曲位置的尖端侧的延伸区域。 延伸区域具有连接部，插入孔在其上容纳电动机线。 延伸区域和垂直于电机线的垂直线之间的端角大于零度。 因此，驱动装置的体积减小。

公开(公告)号：US20150155762A1

公开(公告)日：2015-06-04

申请号：US14553025

申请日：2014-11-25

Applicant: DENSO CORPORATION

Inventor： Mikihiro HIRAMINE ,  Toshihiro FUJITA

IPC: H02K11/00 ,  H01L23/50

CPC classification number: H02K11/33 ,  H01L23/4006 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2924/0002 ,  H02K3/50 ,  H02K5/225 ,  H01L2924/00

Abstract: A semiconductor module includes a switching element, a molded body, and a motor terminal. The molded body having the switching element disposed therein. The motor terminal has a base portion and a connection portion having an insertion hole into which a motor wire is inserted and connected with the winding wire. The connection portion has a cutaway region that defines a slot. The winding wire of the motor and the semiconductor module are connected via the motor wire and the motor terminal, thereby reducing the number of components used for such connection compared with a connection that uses a connector, and achieving a volume reduction of the semiconductor module and a driver device using the same.

Abstract translation: 半导体模块包括开关元件，成型体和电动机端子。 具有设置在其中的开关元件的成型体。 电动机端子具有基部和具有插入孔的连接部，电动机线插入该插入孔并与绕组连接。 连接部分具有限定槽的切口区域。 电动机的绕组线和半导体模块通过电动机线和电动机端子连接，从而与使用连接器的连接相比减少了用于这种连接的部件的数量，并且实现了半导体模块的体积减小和 使用其的驱动器装置。