Invention Application
- Patent Title: SYSTEMS, METHODS, AND APPARATUSES FOR STACKED MEMORY
- Patent Title (中): 堆叠存储器的系统,方法和装置
-
Application No.: US14622776Application Date: 2015-02-13
-
Publication No.: US20150161005A1Publication Date: 2015-06-11
- Inventor: Bryan K. Casper , Stephen R. Mooney , David Dunning , Mozhgan Mansuri , James E. Jaussi
- Applicant: Intel Corporation
- Main IPC: G06F11/10
- IPC: G06F11/10 ; H03M13/15 ; G11C5/02

Abstract:
Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.
Public/Granted literature
- US09886343B2 Systems, methods, and apparatuses for stacked memory Public/Granted day:2018-02-06
Information query