发明申请
US20150171050A1 Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
有权
用于混合键合的导电垫结构及其形成方法
- 专利标题： Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
- 专利标题（中）： 用于混合键合的导电垫结构及其形成方法
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申请号： US14133328申请日： 2013-12-18
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公开(公告)号： US20150171050A1公开(公告)日： 2015-06-18
- 发明人: Sheng-Chau Chen , Shih Pei Chou , Yen-Chang Chu , Cheng-Hsien Chou , Chih-Hui Huang , Yeur-Luen Tu
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L27/146 ; H01L21/48 ; H01L21/324 ; H01L21/02
摘要：
A method embodiment includes patterning an opening through a layer at a surface of a device die. The method further includes forming a liner on sidewalls of the opening, patterning the device die to extend the opening further into the device die. After patterning the device die, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
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