发明申请
- 专利标题： CONFORMAL THIN FILM DEPOSITION OF ELECTROPOSITIVE METAL ALLOY FILMS
- 专利标题（中）： 电镀金属合金膜的合金薄膜沉积
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申请号： US14140042申请日： 2013-12-24
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公开(公告)号： US20150179798A1公开(公告)日： 2015-06-25
- 发明人: SCOTT B. CLENDENNING , PATRICIO PATO ROMERO , GILBERT DEWEY
- 申请人： SCOTT B. CLENDENNING , PATRICIO PATO ROMERO , GILBERT DEWEY
- 主分类号： H01L29/78
- IPC分类号： H01L29/78 ; H01L29/45 ; H01L21/28 ; H01L29/06 ; H01L29/51 ; H01L21/324 ; H01L29/66 ; H01L29/49
摘要：
The present disclosure relates to a method of forming a semiconductor. The method includes heating a substrate in a reaction chamber, supplying to the reaction chamber a first constituent including a metal borohydride wherein the metal borohydride includes at least one of: an alkaline earth metal, a transition metal, or a combination thereof; supplying to the reaction chamber a main-group hydride constituent; and depositing a metal compound on the substrate, wherein the metal compound comprises a) at least one of an alkaline earth metal a transition metal or a combination thereof, b) boron and c) optionally the main group alloying element.
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