Invention Application
US20150185795A1 METHOD AND APPARATUS TO CONFIGURE THERMAL DESIGN POWER IN A MICROPROCESSOR
审中-公开
在微处理器中配置热设计功率的方法和装置
- Patent Title: METHOD AND APPARATUS TO CONFIGURE THERMAL DESIGN POWER IN A MICROPROCESSOR
- Patent Title (中): 在微处理器中配置热设计功率的方法和装置
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Application No.: US14645330Application Date: 2015-03-11
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Publication No.: US20150185795A1Publication Date: 2015-07-02
- Inventor: Eric Distefano , Guy M. Therien , Vasudevan Srinivasan , Tawfik Rahal-Arabi , Venkatesh Ramani , Ryan D. Wells , Stephen H. Gunther , Jeremy Shrall , James Hermerding, II
- Applicant: Intel Corporation
- Main IPC: G06F1/20
- IPC: G06F1/20
Abstract:
A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.
Public/Granted literature
- US09898066B2 Method and apparatus to configure thermal design power in a microprocessor Public/Granted day:2018-02-20
Information query
