Invention Application
- Patent Title: TAPE ASSISTED SINGLE STEP PEEL-OFF ON SIN LAYER ABOVE METAL ELECTRODES
- Patent Title (中): 胶带辅助单步在单层金属电极上剥离
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Application No.: US14422607Application Date: 2013-09-13
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Publication No.: US20150214057A1Publication Date: 2015-07-30
- Inventor: Fatih Mert Ozkeskin , Jose Manuel Dieguez-Campo
- Applicant: APPLIED MATERIALS, INC.
- International Application: PCT/US2013/059691 WO 20130913
- Main IPC: H01L21/268
- IPC: H01L21/268 ; H01L21/02 ; H01L21/321 ; H01L51/00
Abstract:
Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.
Public/Granted literature
- US09627211B2 Tape assisted single step peel-off on sin layer above metal electrodes Public/Granted day:2017-04-18
Information query
IPC分类:
