公开(公告)号：US09627211B2

公开(公告)日：2017-04-18

申请号：US14422607

申请日：2013-09-13

Applicant: Applied Materials, Inc.

Inventor： Fatih Mert Ozkeskin ,  Jose Manuel Dieguez-Campo

IPC: H01L21/268 ,  H01L21/67 ,  H01L51/00 ,  H01L21/02 ,  H01L21/321 ,  H01L51/52

CPC classification number: H01L21/268 ,  H01L21/0217 ,  H01L21/321 ,  H01L21/67092 ,  H01L51/0021 ,  H01L51/0023 ,  H01L51/5206 ,  H01L51/5221

Abstract: Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.

公开(公告)号：US10689760B2

公开(公告)日：2020-06-23

申请号：US15351279

申请日：2016-11-14

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Morrison Neil

IPC: C23C16/54 ,  C23C16/44 ,  C23C16/509 ,  C23C16/455 ,  C23C14/56

Abstract: An apparatus for processing a flexible substrate is provided including a vacuum chamber having a first chamber portion, second chamber portion and third chamber portion. The apparatus further includes an unwinding shaft supporting the flexible substrate to be processed and a winding shaft supporting the flexible substrate after processing, wherein the unwinding shaft and the winding shaft are disposed in the first chamber portion, a first wall separating the first chamber portion from the second chamber portion, wherein the first wall is inclined with respect to a vertical and horizontal orientation, a coating drum having a first portion disposed in the second chamber portion and a second portion disposed in the third chamber portion, and a plurality of processing stations disposed at least partially in the third chamber portion, wherein a majority of the plurality of the processing stations are disposed below a rotational axis of the coating drum.

公开(公告)号：US11713506B2

公开(公告)日：2023-08-01

申请号：US16180800

申请日：2018-11-05

Applicant: Applied Materials, Inc.

Inventor： Stefan Keller ,  Uwe Schüssler ,  Jose Manuel Dieguez-Campo ,  Stefan Bangert ,  Byung-Sung Kwak

IPC: C23C16/448 ,  C23C14/24 ,  H01M4/38 ,  C23C14/54 ,  C23C14/14 ,  C23C16/06 ,  C23C16/455 ,  C23C16/52

CPC classification number: C23C16/4485 ,  C23C14/14 ,  C23C14/246 ,  C23C14/543 ,  C23C16/06 ,  C23C16/4557 ,  C23C16/45519 ,  C23C16/45561 ,  C23C16/45565 ,  C23C16/52 ,  H01M4/381

Abstract: A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.

公开(公告)号：US11673170B2

公开(公告)日：2023-06-13

申请号：US16318052

申请日：2017-04-28

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Stefan Keller ,  Jae Won Lee ,  Takashi Anjiki ,  Dieter Haas

IPC: B08B7/04 ,  B08B3/08 ,  B08B7/00 ,  B08B9/08 ,  C23C14/12 ,  C23C14/24 ,  C23C14/56 ,  H01L51/00 ,  H01L51/56

CPC classification number: B08B7/04 ,  B08B3/08 ,  B08B7/0035 ,  B08B9/08 ,  C23C14/12 ,  C23C14/24 ,  C23C14/566 ,  H01L51/001 ,  H01L51/0011 ,  H01L51/56 ,  B08B2209/08

Abstract: The present disclosure provides a method for cleaning a vacuum system used in the manufacture of OLED devices. The method includes performing pre-cleaning for cleaning at least a portion of the vacuum system, and performing plasma cleaning using a remote plasma source.

公开(公告)号：US20150214057A1

公开(公告)日：2015-07-30

申请号：US14422607

申请日：2013-09-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Fatih Mert Ozkeskin ,  Jose Manuel Dieguez-Campo

IPC: H01L21/268 ,  H01L21/02 ,  H01L21/321 ,  H01L51/00

CPC classification number: H01L21/268 ,  H01L21/0217 ,  H01L21/321 ,  H01L21/67092 ,  H01L51/0021 ,  H01L51/0023 ,  H01L51/5206 ,  H01L51/5221

Abstract: Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.

Abstract translation: 本文描述了用于处理衬底的方法。 从衬底去除层的方法可以包括将衬底定位在处理室内，其中衬底可以包括上表面，以及在上表面上形成有分离能的一个或多个金属特征; 在所述一个或多个金属特征和所述上表面的暴露部分上形成层; 将透射辐射能的源聚焦在该层; 在衬底的上表面上脉冲发射辐射能产生分离的部分和该层的附着部分; 并移除层的分离部分。

公开(公告)号：US10483465B2

公开(公告)日：2019-11-19

申请号：US16300484

申请日：2016-05-10

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Stefan Bangert ,  Andreas Lopp ,  Harald Wurster ,  Dieter Haas

IPC: H01L51/00 ,  H01L51/56 ,  C23C14/12 ,  C23C14/04 ,  C23C14/24 ,  C23C14/56

Abstract: A method of operating a deposition apparatus is provided. The method comprises: Deposition of an evaporated source material on a substrate by guiding the evaporated source material from one or more outlets of an evaporation source toward the substrate, wherein part of the evaporated source material is blocked by and attaches to a shielding device arranged between the one or more outlets and the substrate, followed by a cleaning of the shielding device by at least locally heating the shielding device for releasing at least part of the attached source material from the shielding device. According to a further aspect, a deposition apparatus is provided that can be operated according to the described methods.

公开(公告)号：US09899635B2

公开(公告)日：2018-02-20

申请号：US15113752

申请日：2014-02-04

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Uwe Schüβler ,  Jose Manuel Dieguez-Campo ,  Dieter Haas

IPC: H01L51/40 ,  H01L51/56 ,  C23C14/04 ,  C23C14/12 ,  C23C14/24 ,  C23C14/50 ,  C23C14/56 ,  H01L51/00

CPC classification number: H01L51/56 ,  B05D1/60 ,  C23C14/042 ,  C23C14/12 ,  C23C14/243 ,  C23C14/246 ,  C23C14/505 ,  C23C14/56 ,  C23C14/562 ,  C23C14/564 ,  C23C14/566 ,  C23C14/568 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67271 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/6776 ,  H01L51/001 ,  H01L51/0011

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

公开(公告)号：US09873945B2

公开(公告)日：2018-01-23

申请号：US13871899

申请日：2013-04-26

Applicant: Applied Materials, Inc.

Inventor： Neil Morrison ,  Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Wolfgang Buschbeck

IPC: C23C16/509 ,  C23C16/54 ,  H01J37/32 ,  C23C16/455 ,  C23C16/50

CPC classification number: C23C16/545 ,  C23C16/45517 ,  C23C16/45519 ,  C23C16/50 ,  H01J37/32449 ,  H01J37/32513 ,  H01J37/32568 ,  H01J37/32752 ,  H01J37/32761 ,  H01J37/3277

Abstract: An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.