Invention Application
- Patent Title: TREATED COMPONENT AND METHODS OF FORMING A TREATED COMPONENT
- Patent Title (中): 处理组件和形成处理组件的方法
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Application No.: US14183600Application Date: 2014-02-19
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Publication No.: US20150231796A1Publication Date: 2015-08-20
- Inventor: Srikanth Chandrudu KOTTILINGAM , Jon Conrad SCHAEFFER
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Main IPC: B28B1/00
- IPC: B28B1/00 ; B22F5/04 ; B22F5/00 ; B29D99/00 ; B22F3/26
Abstract:
A treated component and methods for forming a treated component are disclosed. The methods include providing an untreated component having an untreated creep strength. The untreated component is formed by a three-dimensional printing process, and is treated to yield the treated component having a treated creep strength. The treated component comprises an arrangement formed by the three-dimensional printing process, wherein the arrangement has been subjected to treating to increase creep strength.
Public/Granted literature
- US09555612B2 Treated component and methods of forming a treated component Public/Granted day:2017-01-31
Information query
