A high frequency module includes a module board, a connection member, and test terminals. The module board has a first surface on which a transmit antenna and a receive antenna are provided and a second surface on which a signal processing IC is provided, the second surface of the module board being the opposite side of the first surface. The connection member contains wiring for connecting the signal processing IC disposed on the second surface of the module board with another board. The test terminals are connected with the signal processing IC disposed on the second surface of the module board and arranged on the first surface of the module board.