公开(公告)号：US20150303146A1

公开(公告)日：2015-10-22

申请号：US14680039

申请日：2015-04-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/5384 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/04 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/1421 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15333

Abstract: A semiconductor package includes a first substrate including a first surface layer where a first pad region and a second pad region are formed, the first pad region including a plurality of first pads for connection to a first IC, the second pad region including a plurality of second pads for connection to a second substrate, and a second surface layer where a third pad region including a plurality of third pads for connection to a second IC is formed, the second surface layer being formed on an opposite side of the first surface layer. The second pads surround the first pad region in at least three rows, and one or more pads included in the second pads and arranged in an inner portion are connected to one or more pads included in the first pads and to one or more pads included in the third pads.

Abstract translation: 半导体封装包括：第一衬底，其包括形成有第一焊盘区域和第二焊盘区域的第一表面层，所述第一焊盘区域包括用于连接到第一IC的多个第一焊盘，所述第二焊盘区域包括多个 用于连接到第二基板的第二焊盘以及形成有包括用于连接到第二IC的多个第三焊盘的第三焊盘区域的第二表面层，所述第二表面层形成在所述第一表面层的相对侧上。 第二焊盘以至少三行围绕第一焊盘区域，并且包括在第二焊盘中并且布置在内部部分中的一个或多个焊盘连接到包括在第一焊盘中的一个或多个焊盘以及包括在第一焊盘中的一个或多个焊盘 第三垫。

公开(公告)号：US20150288390A1

公开(公告)日：2015-10-08

申请号：US14664954

申请日：2015-03-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H04B1/03

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/043 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10098 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/4913

Abstract: There is provided a radio module including: a first substrate; a second substrate that has a side which is opposed to the first substrate and on which an electronic component is mounted; a conductive member that connects the first substrate and the second substrate and that transmits a signal between the first substrate and the second; at least one first pad that is disposed in the first substrate and connected to the conductive member; and at least one second pad that is disposed in the second substrate and connected to the conductive member, each of the at least one second pad being opposed to each of the at least one first pad and each of larger than the at least one first pad in area.

Abstract translation: 提供了一种无线电模块，包括：第一基板; 第二基板，其具有与第一基板相对的一侧，并且安装有电子部件; 导电构件，其连接所述第一基板和所述第二基板，并且在所述第一基板和所述第二基板之间传递信号; 至少一个第一衬垫，其设置在所述第一衬底中并连接到所述导电构件; 以及至少一个第二垫，其设置在所述第二基板中并连接到所述导电构件，所述至少一个第二垫中的每一个与所述至少一个第一垫中的每一个相对，并且每个第二垫大于所述至少一个第一垫 在区域。

公开(公告)号：US20150357701A1

公开(公告)日：2015-12-10

申请号：US14723133

申请日：2015-05-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SUGURU FUJITA ,  MAKI NAKAMURA

IPC: H01Q1/24 ,  H01Q9/04

CPC classification number: H01Q15/02

Abstract: A wireless device includes an antenna that has a planar shape and radiates a radio signal toward another wireless device, and a chassis housing the antenna and having an outer peripheral portion placed to face the antenna. Multiple distances between a surface of the outer peripheral portion and the antenna are non-uniform.

Abstract translation: 无线装置包括具有平面形状并向另一无线装置发射无线电信号的天线，以及容纳天线并具有面向天线的外周部的底盘。 外周部分的表面与天线之间的多个距离是不均匀的。

公开(公告)号：US20150234003A1

公开(公告)日：2015-08-20

申请号：US14702633

申请日：2015-05-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： RYOSUKE SHIOZAKI ,  YUICHI KASHINO ,  SUGURU FUJITA

IPC: G01R31/28

CPC classification number: G01R31/2822 ,  H01Q1/2283 ,  H01Q23/00 ,  H05K1/0224 ,  H05K1/0268 ,  H05K2201/10098

Abstract: A high frequency module includes a module board, a connection member, and test terminals. The module board has a first surface on which a transmit antenna and a receive antenna are provided and a second surface on which a signal processing IC is provided, the second surface of the module board being the opposite side of the first surface. The connection member contains wiring for connecting the signal processing IC disposed on the second surface of the module board with another board. The test terminals are connected with the signal processing IC disposed on the second surface of the module board and arranged on the first surface of the module board.

Abstract translation: 高频模块包括模块板，连接构件和测试端子。 模块板具有设置发射天线和接收天线的第一表面和设置有信号处理IC的第二表面，模块板的第二表面是与第一表面相反的一侧。 连接构件包含用于将布置在模块板的第二表面上的信号处理IC与另一个板连接的布线。 测试端子与设置在模块板的第二表面上的信号处理IC连接，并布置在模块板的第一表面上。

公开(公告)号：US20150349428A1

公开(公告)日：2015-12-03

申请号：US14722436

申请日：2015-05-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUICHI KASHINO ,  HIROYUKI UNO ,  MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H01Q13/10

CPC classification number: H01Q13/106

Abstract: An antenna device includes a dielectric substrate, a conductor plate that is placed on one surface of the dielectric substrate, that includes a first slot element, a second slot element, and one or more slits, and a ground conductor that is placed at a specified distance from the conductor plate in a first direction. A center of the first slot element is placed between a center of the second slot element and a center of each of slits, in a second direction.

Abstract translation: 天线装置包括电介质基板，放置在电介质基板的一个表面上的导体板，其包括第一槽元件，第二槽元件和一个或多个狭缝，以及接地导体， 距导体板在第一方向的距离。 第一槽元件的中心在第二方向上被放置在第二槽元件的中心和每个狭缝的中心之间。

公开(公告)号：US20150325922A1

公开(公告)日：2015-11-12

申请号：US14702040

申请日：2015-05-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SUGURU FUJITA ,  YUICHI KASHINO ,  MAKI NAKAMURA ,  KENTARO WATANABE

IPC: H01Q19/06 ,  H01Q1/38

CPC classification number: H01Q19/06 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15321 ,  H01Q1/38 ,  H01Q3/16 ,  H01Q19/104 ,  H01Q19/106 ,  H01Q21/065

Abstract: An antenna device includes a wireless module, a module substrate, and a metal plate. The wireless module includes an antenna element that operates in a millimeter wave band. The module substrate is a multi-layer wiring module substrate on which the wireless module is mounted. The metal plate has a length of 1/10 or more of an operation wavelength and is positioned in a vertical direction relative to a plane surface of the antenna element and in a predetermined distance from the antenna element.

Abstract translation: 天线装置包括无线模块，模块基板和金属板。 无线模块包括在毫米波段中操作的天线元件。 模块基板是安装无线模块的多层布线模块基板。 金属板的长度为工作波长的1/10以上，并相对于天线元件的平面而位于与天线元件规定距离的垂直方向上。