Invention Application
- Patent Title: PACKAGE SUBSTRATE AND STRUCTURE
- Patent Title (中): 包装基板和结构
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Application No.: US14453977Application Date: 2014-08-07
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Publication No.: US20150237717A1Publication Date: 2015-08-20
- Inventor: Chang-fu Lin Chang , Chin-Tsai Yao , Ming-Chin Chuang , Ko-Cheng Liu , Fu-Tang Huang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Priority: TW103105445 20140219
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18
Abstract:
A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.
Public/Granted literature
- US09900996B2 Package substrate and structure Public/Granted day:2018-02-20
Information query
