公开(公告)号：US20150237717A1

公开(公告)日：2015-08-20

申请号：US14453977

申请日：2014-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chang-fu Lin Chang ,  Chin-Tsai Yao ,  Ming-Chin Chuang ,  Ko-Cheng Liu ,  Fu-Tang Huang

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/181 ,  H05K1/02 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0191 ,  H05K2201/09736 ,  H05K2201/20 ,  H05K2203/0353 ,  H05K2203/0369 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.

Abstract translation: 提供一种封装基板，其包括多个电介质层和与电介质层交替堆叠的多个电路层。 至少两个电路层的厚度不同，以防止基板翘曲。