Invention Application
- Patent Title: METHOD FOR LASER CUTTING POLYCRYSTALLINE DIAMOND STRUCTURES
- Patent Title (中): 激光切割多晶金刚石结构的方法
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Application No.: US14703741Application Date: 2015-05-04
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Publication No.: US20150239097A1Publication Date: 2015-08-27
- Inventor: Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett
- Applicant: US SYNTHETIC CORPORATION
- Main IPC: B24D18/00
- IPC: B24D18/00 ; B24D3/04 ; B23K26/36

Abstract:
Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.
Public/Granted literature
- US09999962B2 Method for laser cutting polycrystalline diamond structures Public/Granted day:2018-06-19
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