公开(公告)号：US20180043508A1

公开(公告)日：2018-02-15

申请号：US15724546

申请日：2017-10-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  E21B10/567 ,  E21B10/46 ,  B24D3/04 ,  B23K26/364

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US09718168B2

公开(公告)日：2017-08-01

申请号：US14677821

申请日：2015-04-02

Applicant: US SYNTHETIC CORPORATION

Inventor： Debkumar Mukhopadhyay ,  Robert J. Farr ,  Ronald W. Ward ,  Edwin Sean Cox ,  Damon Bart Crockett ,  Daniel Preston Wilding

IPC: E21B10/46 ,  B22F7/00 ,  B24D3/10 ,  B24D18/00 ,  C22C26/00 ,  E21B10/55 ,  E21B10/567 ,  E21B10/573 ,  B22F3/12 ,  B22F3/14 ,  B22F7/06

CPC classification number: B24D3/10 ,  B22F3/1208 ,  B22F3/14 ,  B22F7/06 ,  B24D18/0009 ,  C22C26/00 ,  E21B10/55 ,  E21B10/567 ,  E21B10/5735

Abstract: Embodiments disclosed herein involve polycrystalline diamond (“PCD”) tables and polycrystalline diamond compacts (“PDCs”) that include PCD tables as well as methods and apparatuses for manufacturing thereof. Some embodiments include a canister assembly that may be used in a high-pressure/high-temperature (“HPHT”) process or other heating process to manufacture the PCD tables and/or the PDCs.

公开(公告)号：US12042906B2

公开(公告)日：2024-07-23

申请号：US17172682

申请日：2021-02-10

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US20210162566A1

公开(公告)日：2021-06-03

申请号：US17172682

申请日：2021-02-10

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  E21B10/567 ,  B23K26/364 ,  E21B10/46 ,  B24D3/04

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US10946500B2

公开(公告)日：2021-03-16

申请号：US15724546

申请日：2017-10-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: E21B10/567 ,  E21B10/46 ,  B24D18/00 ,  B23K26/364 ,  B24D3/04

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US20160186805A1

公开(公告)日：2016-06-30

申请号：US15065192

申请日：2016-03-09

Applicant: US Synthetic Corporation

Inventor： S. Barrett Peterson ,  Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Edward Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: F16C33/10 ,  F16C33/04

CPC classification number: F16C33/108 ,  B21K1/04 ,  E21B4/003 ,  E21B17/03 ,  F16C17/02 ,  F16C17/04 ,  F16C33/043 ,  F16C33/1085 ,  F16C33/26 ,  F16C37/002 ,  F16C2206/04 ,  F16C2206/82 ,  F16C2240/42 ,  F16C2240/48 ,  F16C2352/00 ,  Y10T29/49645

Abstract: Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.

公开(公告)号：US09334694B2

公开(公告)日：2016-05-10

申请号：US14452206

申请日：2014-08-05

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/56 ,  F16C33/04 ,  E21B10/567 ,  E21B10/55

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C33/04 ,  F16C33/043 ,  F16C2206/04 ,  F16C2352/00

Abstract: Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDCs may include at least one stress relieving partition.

Abstract translation: 在多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中至少部分减轻应力的方法包括分割PDC的基底，PDC的PCD表或两者。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 PDC可以包括至少一个应力消除分隔。

公开(公告)号：US20240399540A1

公开(公告)日：2024-12-05

申请号：US18741013

申请日：2024-06-12

Applicant: US Synthetic Corporation

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US09999962B2

公开(公告)日：2018-06-19

申请号：US14703741

申请日：2015-05-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: E21B10/46 ,  B24D18/00 ,  E21B10/567 ,  B24D3/04 ,  B23K26/364

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US20160230471A1

公开(公告)日：2016-08-11

申请号：US15134158

申请日：2016-04-20

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/567 ,  B24D18/00 ,  E21B4/00 ,  F16C33/04 ,  E21B10/55 ,  E21B10/573

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C17/02 ,  F16C17/04 ,  F16C33/04 ,  F16C33/043 ,  F16C33/26 ,  F16C2206/04 ,  F16C2352/00

Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.

Abstract translation: 通过划分PDC的底物，PDC的PCD表或两者，至少部分地减轻多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中的应力的方法的实施方案。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 还公开了包括至少一个应力释放分隔件的PDC实施例。