发明申请
- 专利标题： METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTRONIC PACKAGE
- 专利标题（中）： 将第一电子包连接到第二电子包的方法
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申请号： US14219749申请日： 2014-03-19
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公开(公告)号： US20150270169A1公开(公告)日： 2015-09-24
- 发明人: Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
- 申请人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L21/56 ; H01L23/00 ; H01L25/00 ; H01L25/065
摘要：
A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
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