发明申请
- 专利标题： FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
- 专利标题（中）： 灵活的底层组合物，以提高可靠性
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申请号： US14746750申请日： 2015-06-22
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公开(公告)号： US20150284503A1公开(公告)日： 2015-10-08
- 发明人: Dingying XU , Nisha ANANTHAKRISHNAN , Hong DONG , Rahul N. MANEPALLI , Nachiket R. RARAVIKAR , Gregory S. CONSTABLE
- 申请人： INTEL CORPORATION
- 主分类号： C08G59/02
- IPC分类号： C08G59/02 ; C07F7/08
摘要：
Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
公开/授权文献
- US09458283B2 Flexible underfill compositions for enhanced reliability 公开/授权日：2016-10-04
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