公开(公告)号：US20230137877A1

公开(公告)日：2023-05-04

申请号：US17517152

申请日：2021-11-02

申请人： Intel Corporation

发明人： Bohan SHAN ,  Haobo CHEN ,  Omkar KARHADE ,  Malavarayan SANKARASUBRAMANIAN ,  Dingying XU ,  Gang DUAN ,  Bai NIE ,  Xiaoying GUO ,  Kristof DARMAWIKARTA ,  Hongxia FENG ,  Srinivas PIETAMBARAM ,  Jeremy D. ECTON

IPC分类号： H01L23/00 ,  H01L25/065

摘要： No-remelt solder joints can eliminate die or substrate movement in downstream reflow processes. In one example, one or more solder joints between two substrates can be formed as full IMC (intermetallic compound) solder joints. In one example, a full IMC solder joint includes a continuous layer (e.g., from the top pad to bottom pad) of intermetallic compounds. In one example, a full IMC joint can be formed by dispensing a no-remelt solder paste on some of the pads of one or both substrates to be bonded together.

公开(公告)号：US20170033069A1

公开(公告)日：2017-02-02

申请号：US15295952

申请日：2016-10-17

申请人： Intel Corporation

发明人： Mihir A. Oka ,  Edward R. PRACK ,  Dingying XU ,  Saikumar JAYARAMAN

IPC分类号： H01L23/00 ,  C09D5/20 ,  C09D7/12 ,  H01L21/02 ,  H01L21/311

CPC分类号： H01L24/11 ,  C08G73/22 ,  C09D5/20 ,  C09D7/63 ,  C09D179/04 ,  C09D179/08 ,  C09D181/04 ,  H01L21/02112 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/31127 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/11009 ,  H01L2224/11332 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2924/095 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  C08L83/04

摘要： Techniques are disclosed for protecting a surface using a dry-removable protective coating that does not require chemical solutions to be removed. In an embodiment, a protective layer is disposed on a surface. The protective layer is composed of one layer that adheres to the surface. The surface is then processed while the protective coating is on the surface. Thereafter, the protective layer is removed from the surface by separating the protective layer away from the surface without the use of chemical solutions.

摘要翻译： 公开了用于使用不需要除去化学溶液的可干燥去除的保护涂层来保护表面的技术。 在一个实施例中，保护层设置在表面上。 保护层由附着在表面上的一层组成。 然后在表面上保护表面进行处理。 此后，通过将保护层从表面分离而不使用化学溶液，从表面除去保护层。

公开(公告)号：US20240327679A1

公开(公告)日：2024-10-03

申请号：US18194395

申请日：2023-03-31

申请人： Intel Corporation

发明人： Yuan MENG ,  Elizabeth NOFEN ,  Zhixin XIE ,  Dingying XU ,  Seyed Hadi ZANDAVI

IPC分类号： C09J7/38 ,  C09J11/04 ,  H05K13/00

CPC分类号： C09J7/38 ,  C09J11/04 ,  H05K13/0069 ,  C09J2301/408

摘要： This disclosure describes systems, methods, and devices related to switchable adhesion. A switchable adhesion system may comprise a shape memory polymer having a shaped surface to enhance adhesion using a trigger and a force applied to the shape memory polymer, wherein the trigger is applied to alter characteristics of the shape memory polymer, and wherein the force is applied to deform the shape memory polymer while the trigger is applied. The system may further comprise a media tray connected to the shape memory polymer.

公开(公告)号：US20200312771A1

公开(公告)日：2020-10-01

申请号：US16366661

申请日：2019-03-27

申请人： Intel Corporation

发明人： Bai NIE ,  Gang DUAN ,  Srinivas PIETAMBARAM ,  Jesse JONES ,  Yosuke KANAOKA ,  Hongxia FENG ,  Dingying XU ,  Rahul MANEPALLI ,  Sameer PAITAL ,  Kristof DARMAWIKARTA ,  Yonggang LI ,  Meizi JIAO ,  Chong ZHANG ,  Matthew TINGEY ,  Jung Kyu HAN ,  Haobo CHEN

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

摘要： A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

公开(公告)号：US20240203806A1

公开(公告)日：2024-06-20

申请号：US18085291

申请日：2022-12-20

申请人： Intel Corporation

发明人： Bohan Shan ,  Bai Nie ,  Leonel R. Arana ,  Dingying XU ,  Srinivas Venkata Ramanuja Pietambaram ,  Hongxia Feng ,  Gang Duan ,  Xiaoying Guo ,  Jeremy D. Ecton ,  Haobo Chen ,  Bin Mu

IPC分类号： H01L23/15 ,  C03C17/00 ,  C03C17/06 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/15 ,  C03C17/004 ,  C03C17/06 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  C03C2217/253 ,  C03C2218/365

摘要： An electronic device, including layers, formed from a material that can remain substantially constant in structure, such as glass. The layer can be preformed with through glass vias that support at least one electrically conductive interconnect. The through glass via can have an edge region that can be substantially coplanar with an exposed surface of the layer.

公开(公告)号：US20210318612A1

公开(公告)日：2021-10-14

申请号：US17356536

申请日：2021-06-24

申请人： Intel Corporation

发明人： Hongxia FENG ,  Changhua LIU ,  Bohan SHAN ,  Dingying XU ,  Leonel ARANA ,  Manuel GADOGBE ,  Matthew TINGEY ,  Julianne TROIANO

IPC分类号： G03F7/038 ,  G03F7/20 ,  G03F7/32

摘要： The present disclosure is directed to a patterning process that includes providing a composite dry film resist on a surface, in which the composite dry film resist includes a base film, a barrier layer and a resist layer, in which the base film is disposed over the barrier layer and the barrier layer is disposed over the resist layer. In another aspect, the patterning process includes removing the base film from the barrier layer and exposing the barrier layer to form an exposure precursor, which has a first area and a second area, further exposing the first area of the exposure precursor to electromagnetic irradiation, which passes through the barrier layer and the resist layer in the exposed first area becomes water-insoluble, and removing the barrier layer and the unexposed second area to form a pattern template.

公开(公告)号：US20150284503A1

公开(公告)日：2015-10-08

申请号：US14746750

申请日：2015-06-22

申请人： INTEL CORPORATION

发明人： Dingying XU ,  Nisha ANANTHAKRISHNAN ,  Hong DONG ,  Rahul N. MANEPALLI ,  Nachiket R. RARAVIKAR ,  Gregory S. CONSTABLE

IPC分类号： C08G59/02 ,  C07F7/08

CPC分类号： C08G59/02 ,  C07F7/0838 ,  C08G59/3254 ,  C08G59/38 ,  C08L23/0884 ,  H01L21/563 ,  H01L23/293 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3512 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2224/05599

摘要： Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.

摘要翻译： 描述了用于制造电子设备的底部填充材料。 一个实施方案包括含有环氧混合物，胺硬化剂组分和填料的底部填充组合物。 环氧混合物可包括包含双酚环氧树脂的第一环氧树脂，包含多官能环氧树脂的第二环氧树脂和包含脂族环氧树脂的第三环氧树脂，所述脂族环氧树脂包含硅氧烷环氧树脂。 第一，第二和第三环氧树脂各自具有不同的化学结构。 描述和要求保护其他实施例。

公开(公告)号：US20240332125A1

公开(公告)日：2024-10-03

申请号：US18128848

申请日：2023-03-30

申请人： Intel Corporation

发明人： Kyle ARRINGTON ,  Clay ARRINGTON ,  Bohan SHAN ,  Haobo CHEN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Ziyin LIN ,  Hongxia FENG ,  Yiqun BAI ,  Xiaoying GUO ,  Dingying XU ,  Bai NIE

IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/24 ,  H01L23/498

CPC分类号： H01L23/3737 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/24 ,  H01L23/49822 ,  H01L23/49827

摘要： Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a first layer and a second layer over the first layer. In an embodiment, the second layer comprises a dielectric material including sulfur. In an embodiment, fillers are within the second layer. In an embodiment, the fillers have a volume fraction that is less than approximately 0.2.

公开(公告)号：US20240153837A1

公开(公告)日：2024-05-09

申请号：US17983226

申请日：2022-11-08

申请人： Intel Corporation

发明人： Ziyin LIN ,  Vipul MEHTA ,  Jonas CROISSANT ,  Jigneshkumar PATEL ,  Dingying XU ,  Gang DUAN ,  Aditya Sumanth YERRAMILLI ,  Suriyakala RAMALINGAM ,  Xavier BRUN

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L25/18

CPC分类号： H01L23/3157 ,  H01L23/49811 ,  H01L25/18 ,  H01L24/32 ,  H01L2224/32225

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die, and an array of pillars adjacent to the die. In an embodiment, the electronic package further comprises an underfill under the die, where an edge of the underfill is between an inner column of pillars in the array of pillars and an outer edge of the die, and where the edge of the underfill has a height that is less than a maximum height of the underfill.

公开(公告)号：US20240088052A1

公开(公告)日：2024-03-14

申请号：US18513015

申请日：2023-11-17

申请人： Intel Corporation

发明人： Bai NIE ,  Gang DUAN ,  Srinivas PIETAMBARAM ,  Jesse JONES ,  Yosuke KANAOKA ,  Hongxia FENG ,  Dingying XU ,  Rahul MANEPALLI ,  Sameer PAITAL ,  Kristof DARMAWIKARTA ,  Yonggang LI ,  Meizi JIAO ,  Chong ZHANG ,  Matthew TINGEY ,  Jung Kyu HAN ,  Haobo CHEN

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/3511 ,  H01L2924/381

摘要： A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.