Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体器件
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Application No.: US14651643Application Date: 2012-12-19
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Publication No.: US20150318245A1Publication Date: 2015-11-05
- Inventor: Shinichi UCHIDA , Hirokazu NAGASE , Takuo FUNAYA
- Applicant: RENESAS ELECTRONICS CORPORATION
- International Application: PCT/JP2012/082932 WO 20121219
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L25/065 ; H01L23/528 ; H01L23/00 ; H01L23/66 ; H01L23/64
Abstract:
On a semiconductor substrate, coils CL5 and CL6 and pads PD5, PD6, and PD7 are formed. The coil CL5 and the coil CL6 are electrically connected in series between the pad PD5 and the pad PD6, and the pad PD7 is electrically connected between the coil CL5 and the coil CL6. The coil magnetically coupled to the coil CL5 is formed just below the coil CL5, the coil magnetically coupled to the coil CL6 is formed just below the coil CL6, and they are connected in series. When a current is flowed in the coils connected in series formed just below the coils CL5 and CL6, directions of induction current flowing in the coils CL5 and CL6 are opposed to each other in the coils CL5 and CL6.
Public/Granted literature
- US09536828B2 Semiconductor device Public/Granted day:2017-01-03
Information query
IPC分类:
