Invention Application
- Patent Title: COIL MODULE
- Patent Title (中): 线圈模块
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Application No.: US14649388Application Date: 2013-11-27
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Publication No.: US20150325362A1Publication Date: 2015-11-12
- Inventor: Tatsuo KUMURA , Yusuke KUBO
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2012-265135 20121204
- International Application: PCT/JP2013/081836 WO 20131127
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F38/14 ; H01F27/255 ; H01F27/29

Abstract:
A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.
Public/Granted literature
- US10002704B2 Coil module Public/Granted day:2018-06-19
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