Abstract:
Provided is a coil module which is reduced in size and made slimmer by incorporating a material and structure resistant to magnetic saturation. The coil module has: a magnetic resin layer containing magnetic particles; and a spiral coil, wherein the magnetic resin layer contains magnetic particles having a spherical shape or a spheroid shape having a dimensional ratio of not more than 6, the dimensional ratio being expressed as a ratio of the major diameter to the minor diameter.
Abstract:
A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.
Abstract:
An invented antenna device includes a spiral coil having terminal wires extending from an inner periphery side thereof and from an outer periphery side thereof, a magnetic layer supporting the spiral coil and being formed with a cutoff portion extending from an inner periphery side thereof to an outer periphery side thereof, and a circuit board having a pair of terminal portions for connecting to the terminal wire and a connecting terminal for connecting an external circuit. The circuit board is placed in the cutoff portion, and the terminal wire extending from the inner periphery side of the spiral coil is coupled to the terminal portion located on an inner periphery side of the circuit board whereas the terminal wire extending from the outer periphery side of the spiral coil is coupled to the terminal portion located on an outer periphery side of the circuit board.
Abstract:
An antenna device according to the invention includes a spiral coil, a magnetic layer supporting the spiral coil and including a recess or a through hole for containing an extension from an inner periphery of the spiral coil, and a circuit board having a plurality of conducting patterns and being formed with a first terminal connecting the spiral coil to the conducting patterns and with a second terminal connecting the conducting patterns to an external circuit. The magnetic layer has at least a part of the circuit board inside. This invented antenna device is formed in a thinner size.
Abstract:
Provided is a semiconductor device having excellent heat radiation performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening hole 21; a conductive cooling member 40 located above the conductive shield can 20; a heat conductive sheet 10 formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening hole 21; and a conductive member 11 electrically connecting the conductive shield can 20 and the conductive cooling member 40.
Abstract:
Provided is a contactless power supply antenna device that has raised power transmission efficiency while also enabling size-reduction for mounting on a wearable terminal or the like. The antenna device includes a power transmission antenna (2) and a power reception antenna (3). The power transmission antenna (2) includes: a magnetic core including two magnetic plates (21) that face each other, a magnetic material-containing connecting portion (22) that connects at least part of an end section of each of the two magnetic plates (21), and a space (23) between the two magnetic plates (21); and a power transmission coil (25) disposed on at least one of the two magnetic plates (21) at a side thereof that faces the space (23). The power reception antenna (3) includes a power reception coil (31) and is positionable in the space (23).
Abstract:
Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.
Abstract:
Provided is a heat conductive sheet having an excellent electromagnetic wave suppressing effect in addition to excellent thermal conductivity. A heat conductive sheet 1 includes a heat conductive sheet body 10 containing a binder resin 11 and fibrous heat conductive fillers 12, and a low permittivity partition member 20 which has a lower dielectric constant than the heat conductive sheet body 10 and separates at least part of the heat conductive sheet body 10.
Abstract:
Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.