Invention Application
US20150327367A1 CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION
有权
具有多个插入式基板的电路组件,以及制造方法
- Patent Title: CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION
- Patent Title (中): 具有多个插入式基板的电路组件,以及制造方法
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Application No.: US14275741Application Date: 2014-05-12
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Publication No.: US20150327367A1Publication Date: 2015-11-12
- Inventor: Hong SHEN , Zhuowen Sun , Charles G. Woychik , Arkalgud Sitaram
- Applicant: Invensas Corporation
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/18 ; H05K1/02 ; H01L25/065 ; H01L25/00

Abstract:
A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120.iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided.
Public/Granted literature
- US09402312B2 Circuit assemblies with multiple interposer substrates, and methods of fabrication Public/Granted day:2016-07-26
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