Invention Application
US20150355220A1 INERTIAL SENSOR MODULE HAVING HERMETIC SEAL FORMED OF METAL AND MULTI-AXIS SENSOR EMPLOYING THE SAME
审中-公开
具有使用其的金属和多轴传感器形成的密封的惯性传感器模块
- Patent Title: INERTIAL SENSOR MODULE HAVING HERMETIC SEAL FORMED OF METAL AND MULTI-AXIS SENSOR EMPLOYING THE SAME
- Patent Title (中): 具有使用其的金属和多轴传感器形成的密封的惯性传感器模块
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Application No.: US14690839Application Date: 2015-04-20
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Publication No.: US20150355220A1Publication Date: 2015-12-10
- Inventor: Pil Joong KANG , Jung Won LEE , Hyun Kee LEE , Jong Hyeong SONG
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0070116 20140610
- Main IPC: G01P15/12
- IPC: G01P15/12 ; G01P15/093 ; G01P15/125 ; G01P15/02

Abstract:
There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.
Information query
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