公开(公告)号：US20170237410A1

公开(公告)日：2017-08-17

申请号：US15271646

申请日：2016-09-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yun Sung KANG ,  Ji Hye NAM ,  Kwang Su KIM ,  Pil Joong KANG ,  Jeong Il LEE

IPC: H03H9/54 ,  H01L41/29 ,  H03H9/64

CPC classification number: H03H9/54 ,  H01L41/29 ,  H03H9/1014 ,  H03H9/1064 ,  H03H9/64

Abstract: An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.

公开(公告)号：US20180068915A1

公开(公告)日：2018-03-08

申请号：US15807805

申请日：2017-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Yun Sung KANG ,  Seung Joo SHIN ,  Nam Jung LEE

IPC: H01L23/10 ,  H03H3/02 ,  H03H9/13 ,  H03H9/02 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H03H3/02 ,  H03H9/02007 ,  H03H9/1014 ,  H03H9/13 ,  H03H2003/021

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

公开(公告)号：US20150355219A1

公开(公告)日：2015-12-10

申请号：US14589206

申请日：2015-01-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Pil Joong KANG ,  Jung Won LEE ,  Hyun Kee LEE ,  Jong Hyeong SONG

IPC: G01P15/12 ,  G01P15/093 ,  G01P15/125

CPC classification number: G01P15/123 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81B2207/012 ,  B81C2201/019 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/093 ,  G01P15/125 ,  G01P2015/0842

Abstract: Embodiments of the invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force.

Abstract translation: 本发明的实施例提供一种多轴传感器，其包括嵌入在嵌入式基板中以感测位置的第一传感器，以及通过晶片级封装方案形成在嵌入式基板上的下盖基板上的第二传感器，以感测惯性 力。

公开(公告)号：US20170179919A1

公开(公告)日：2017-06-22

申请号：US15073851

申请日：2016-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Suong YANG ,  Jeong Il LEE ,  Yun Sung KANG ,  Kwang Su KIM ,  Pil Joong KANG

IPC: H03H9/02 ,  H03H9/05 ,  H03H3/02 ,  H03H9/17

CPC classification number: H03H9/02007 ,  H03H3/02 ,  H03H9/0504 ,  H03H9/1014 ,  H03H9/17 ,  H03H9/173

Abstract: An acoustic resonator and a method of manufacturing the same are provided. An acoustic resonator includes a resonating part disposed on a substrate, a cap accommodating the resonating part and bonded to the substrate, and a bonded part bonding the cap and the substrate to each other, the bonding part including at least one block disposed between a bonding surface of the cap and a bonding surface of the substrate to block a leakage of a bonding material that forms the bonded part during a bonding operation.

公开(公告)号：US20150355220A1

公开(公告)日：2015-12-10

申请号：US14690839

申请日：2015-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Pil Joong KANG ,  Jung Won LEE ,  Hyun Kee LEE ,  Jong Hyeong SONG

IPC: G01P15/12 ,  G01P15/093 ,  G01P15/125 ,  G01P15/02

CPC classification number: G01P15/123 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/035 ,  G01C19/56 ,  G01P15/09 ,  G01P15/093 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0842

Abstract: There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.

Abstract translation: 提供了一种惯性传感器模块，其具有由金属形成的气密密封件和使用其的多轴传感器。 惯性传感器模块包括：传感器主体，包括连接到传感器的驱动电极和传感器的感测电极中的任何一个的多个布线，并且通过晶片级封装（WLP）形成在用于下盖的基板上， 检测惯性力的方案; 用于上盖的基板，其接合在所述传感器主体上以保护所述传感器主体; 以及通过金属接合进行接合而由与配线隔离并插入到传感器主体和上盖的基板中的金属形成的气密密封。

公开(公告)号：US20130169723A1

公开(公告)日：2013-07-04

申请号：US13710742

申请日：2012-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Pil Joong KANG ,  Seung Joo Shin ,  Tae Kyung Lee ,  Hwa Sun Lee

IPC: B41J2/175

CPC classification number: B41J2/17513 ,  B41J2/14233 ,  B41J2002/14403 ,  B41J2002/14491

Abstract: There is provided an inkjet print head including: an ink discharge unit including nozzles, pressure chambers, restrictors, manifolds, and actuators; an ink supply unit including an ink tank supplying ink to the manifolds and circuit boards delivering control signals to the actuators; and a connection unit electrically connecting the circuit boards and the actuators, wherein the ink supply unit is formed integrally with the ink discharge unit.

Abstract translation: 提供了一种喷墨打印头，包括：喷墨单元，其包括喷嘴，压力室，限流器，歧管和致动器; 墨水供应单元，其包括向所述歧管供应墨水的墨槽和向所述致动器输送控制信号的电路板; 以及电连接电路板和致动器的连接单元，其中所述供墨单元与所述排墨单元一体地形成。

公开(公告)号：US20180137983A1

公开(公告)日：2018-05-17

申请号：US15676425

申请日：2017-08-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： No Il PARK ,  Pil Joong KANG ,  Seung Mo LIM ,  Hyun Ho SHIN

IPC: H01G4/30 ,  H01G4/232

CPC classification number: H01G4/306 ,  H01G4/232 ,  H01G4/33 ,  H05K1/162

Abstract: A multilayer thin-film capacitor includes a multilayer body in which a plurality of dielectric layers and first and second internal electrode layers are alternately stacked, and first and second external electrodes are disposed on the multilayer body and connected to the first and second internal electrode layers, respectively. The multilayer thin-film capacitor may include a first edge via connected to the external electrode and disposed at or adjacent at least one edge of an upper surface of the multilayer body, and a second edge via connected to the second external electrode and disposed at or adjacent at least one edge of the upper surface of the multilayer body.

公开(公告)号：US20170230032A1

公开(公告)日：2017-08-10

申请号：US15276986

申请日：2016-09-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yun Sung KANG ,  Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Suong YANG ,  Jeong Il LEE ,  Jong Hyeong SONG

IPC: H03H9/56 ,  H03H9/64

CPC classification number: H03H9/56 ,  H03H3/02 ,  H03H3/08 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/64

Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

公开(公告)号：US20130286107A1

公开(公告)日：2013-10-31

申请号：US13766409

申请日：2013-02-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Pil Joong KANG ,  Yoon Sok PARK

IPC: B41J2/045

CPC classification number: B41J2/04525 ,  B41J2/055 ,  B41J2/14233 ,  B41J2002/14403 ,  B41J2002/14419

Abstract: There is provided an inkjet print head including: a nozzle substrate having a nozzle and a pressure chamber formed therein; and a vibrating substrate coupled to the nozzle substrate and transferring pressure from a piezoelectric actuator to the pressure chamber, wherein the vibrating substrate has a plurality of pores absorbing a pressure wave generated in a process of discharging ink.

Abstract translation: 提供了一种喷墨打印头，包括：喷嘴基板，其具有形成在其中的喷嘴和压力室; 以及耦合到所述喷嘴基板并将压力从压电致动器传递到所述压力室的振动基板，其中所述振动基板具有吸收在排墨过程中产生的压力波的多个孔。

公开(公告)号：US20170271573A1

公开(公告)日：2017-09-21

申请号：US15272618

申请日：2016-09-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Hyun Kee LEE ,  Yun Sung KANG ,  Seung Joo SHIN ,  Jeong Suong YANG

IPC: H01L41/053 ,  H03H9/54 ,  H03H9/17

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.