Invention Application
- Patent Title: Two Terminal Packaging
- Patent Title (中): 两端包装
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Application No.: US14834606Application Date: 2015-08-25
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Publication No.: US20150364443A1Publication Date: 2015-12-17
- Inventor: Yuri Bilenko , Michael Shur , Remigijus Gaska , Alexander Dobrinsky
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: SENSOR ELECTRONIC TECHNOLOGY, INC.
- Current Assignee: SENSOR ELECTRONIC TECHNOLOGY, INC.
- Current Assignee Address: US SC Columbia
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/78 ; H01L25/075 ; H01L25/07 ; H01L33/00 ; H01L33/62
Abstract:
A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.
Public/Granted literature
- US09627351B2 Device electrode formation using metal sheet Public/Granted day:2017-04-18
Information query
IPC分类:
