Invention Application
US20150378957A1 EMPLOYING MULTIPLE I2C DEVICES BEHIND A MICROCONTROLLER IN A DETACHABLE PLATFORM
审中-公开
使用多个I2C设备在可拆卸平台中安装微控制器
- Patent Title: EMPLOYING MULTIPLE I2C DEVICES BEHIND A MICROCONTROLLER IN A DETACHABLE PLATFORM
- Patent Title (中): 使用多个I2C设备在可拆卸平台中安装微控制器
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Application No.: US14318461Application Date: 2014-06-27
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Publication No.: US20150378957A1Publication Date: 2015-12-31
- Inventor: NICHOLAS J. ADAMS , BASAVARAJ B. ASTEKAR
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F13/10 ; G06F9/54 ; G06F13/40

Abstract:
Methods and apparatus relating to employing multiple I2C (Interface to Communicate) devices behind a microcontroller in a detachable platform are described. In an embodiment, first logic receives a first message via a serial single ended (such as an Interface to Communicate (I2C)) bus. The first logic generates a second message to be transmitted to second logic in response to a determination that the first message is not directed to an address space assigned to the first logic. The second message includes information from the first message. Other embodiments are also disclosed.
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