A method for forming a vertical electrical conductive connection includes forming an electrically insulating layer including at least one hole reaching vertically through the electrically insulating layer and depositing an electrically conductive layer. A surface of the electrically conductive layer includes a recess at the location of the at least one hole of the electrically insulating layer. Further, the method includes forming a smoothing layer on the electrically conductive layer and etching the smoothing layer and the electrically conductive layer until the electrically conductive layer is removed above at least a part of a surface of the electrically insulating layer and remains within the at least one hole.