发明申请
- 专利标题: SUBSTRATE TREATING APPARATUS AND METHOD
- 专利标题(中): 基板处理装置和方法
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申请号: US14747287申请日: 2015-06-23
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公开(公告)号: US20160001332A1公开(公告)日: 2016-01-07
- 发明人: Jong Han Kim , Yoon-Jong Ju , Yu Hwan Kim , Edwin Lee , Seong Soo Lee
- 申请人: Jong Han Kim , Yoon-Jong Ju , Yu Hwan Kim , Edwin Lee , Seong Soo Lee
- 申请人地址: KR Chungcheongnam-do
- 专利权人: SEMES CO., LTD.
- 当前专利权人: SEMES CO., LTD.
- 当前专利权人地址: KR Chungcheongnam-do
- 优先权: KR10-2014-0084394 20140707
- 主分类号: B08B3/10
- IPC分类号: B08B3/10 ; B08B3/02
摘要:
The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.
公开/授权文献
- US10357806B2 Substrate treating apparatus and method 公开/授权日:2019-07-23