An electrical component has an electronic part, a primer layer covering at least partially the electronic part, and a sealing resin covering at least partially the electronic part and the primer layer. The primer layer contains a polyimide polymer having the structure represented by the following chemical formula (1), and the sealing resin contains an epoxy-based resin and/or maleimide-based resin. (In the formula (1), R1 is a tetravalent alicyclic hydrocarbon group, tetravalent aliphatic hydrocarbon group, or tetravalent aromatic hydrocarbon group, and may contain O or/and S. In the formula (1), R2 is H or 1-3C alkyl group. In the formula (1), n1 is an integer from 1 to 10 (inclusive), and m is an integer from 1 to 100000 (inclusive).)