公开(公告)号：US20200291170A1

公开(公告)日：2020-09-17

申请号：US16886070

申请日：2020-05-28

Applicant: DENSO CORPORATION

Inventor： Hiroyuki OKUHIRA ,  Akira TAKAKURA

IPC: C08G18/73 ,  C08G18/32 ,  C08G18/76

Abstract: A curable resin composition comprises a (meth)acrylic polyol, a polycarbonate-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. An electrical component (1) comprises a sealing material (2) including a cured product of the curable resin composition.

公开(公告)号：US20210002413A1

公开(公告)日：2021-01-07

申请号：US16886270

申请日：2020-05-28

Applicant: DENSO CORPORATION

Inventor： Hiroyuki OKUHIRA ,  Akira TAKAKURA ,  Takashi AOKI

IPC: C08G18/73 ,  C08G18/32 ,  C09J175/04

Abstract: A curable resin composition comprises a (meth)acrylic polyol, a castor oil-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20,000 or less, which is liquid at 25° C. An electrical component (1) comprises a sealing material (2) including a cured product of the curable resin composition.

公开(公告)号：US20160001528A1

公开(公告)日：2016-01-07

申请号：US14789170

申请日：2015-07-01

Applicant: DENSO CORPORATION

Inventor： Akira TAKAKURA ,  Hiroyuki OKUHIRA

IPC: B32B27/06 ,  B32B27/28 ,  B32B27/38

CPC classification number: B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/281 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2457/00 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical component has an electronic part, a primer layer covering at least partially the electronic part, and a sealing resin covering at least partially the electronic part and the primer layer. The primer layer contains a polyimide polymer having the structure represented by the following chemical formula (1), and the sealing resin contains an epoxy-based resin and/or maleimide-based resin. (In the formula (1), R1 is a tetravalent alicyclic hydrocarbon group, tetravalent aliphatic hydrocarbon group, or tetravalent aromatic hydrocarbon group, and may contain O or/and S. In the formula (1), R2 is H or 1-3C alkyl group. In the formula (1), n1 is an integer from 1 to 10 (inclusive), and m is an integer from 1 to 100000 (inclusive).)

Abstract translation: 电气部件具有电子部件，至少部分地覆盖电子部件的底漆层和至少部分地覆盖电子部件和底漆层的密封树脂。 底漆层含有具有下述化学式（1）所示结构的聚酰亚胺聚合物，密封树脂含有环氧类树脂和/或马来酰亚胺类树脂。 （式（1）中，R 1为四价脂环族烃基，四价脂肪族烃基或四价芳香族烃基，可以含有O或/和S.在式（1）中，R 2为H或1-3C 在式（1）中，n1为1〜10的整数，m为1〜100000的整数）。

公开(公告)号：US20150166728A1

公开(公告)日：2015-06-18

申请号：US14564704

申请日：2014-12-09

Applicant: DENSO CORPORATION

Inventor： Hiroyuki OKUHIRA ,  Akira TAKAKURA ,  Katsuhiro KANIE

IPC: C08G73/10 ,  H01L23/29 ,  C09D163/00 ,  C09D179/08 ,  C08G59/50 ,  C08G59/62

CPC classification number: H01L23/293 ,  C08G59/245 ,  C08G59/5033 ,  C08G59/56 ,  C08G59/621 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1078 ,  C09D179/08 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A curable resin composition includes a main agent, an amine-based curing agent, and a phenol-based curing agent. The main agent includes at least one of a maleimide compound and an epoxy compound. The amine-based curing agent is made of aromatic polyamine. The phenol-based curing agent is made of phenols that has a phenolic OH equivalent of equal to or less than 90 and has a softening point or a melting point of equal to or lower than 100° C.

Abstract translation: 可固化树脂组合物包括主剂，胺类固化剂和酚类固化剂。 主剂包括马来酰亚胺化合物和环氧化合物中的至少一种。 胺系固化剂由芳香族多胺构成。 酚类固化剂由酚OH当量等于或小于90且软化点或熔点等于或低于100℃的酚制成。