Invention Application
- Patent Title: CONTROL OF O-INGRESS INTO GATE STACK DIELECTRIC LAYER USING OXYGEN PERMEABLE LAYER
- Patent Title (中): 使用氧气渗透层控制输入层压电介质层
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Application No.: US14323036Application Date: 2014-07-03
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Publication No.: US20160005620A1Publication Date: 2016-01-07
- Inventor: Takashi Ando , Claude Ortolland , Kai Zhao
- Applicant: International Business Machines Corporation
- Main IPC: H01L21/3115
- IPC: H01L21/3115 ; H01L29/51 ; H01L29/66

Abstract:
A method of manufacturing a semiconductor structure, by depositing a dielectric layer is a dummy gate, or an existing gate structure, prior to the formation of gate spacers. Following the formation of spacers, and in some embodiments replacing a dummy gate with a final gate structure, oxygen is introduced to a gate dielectric through a diffusion process, using the deposited dielectric layer as a diffusion pathway.
Public/Granted literature
- US09620384B2 Control of O-ingress into gate stack dielectric layer using oxygen permeable layer Public/Granted day:2017-04-11
Information query
IPC分类: