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发明申请
US20160005902A1 Direct Thermal Path Heat Sinking Using Fins Formed From Energy Conversion Device Components, Including Subcomponents of Vertical Multijunction Photovoltaic Receivers Used For High Intensity Beaming and Wireless Power Transmission 审中-公开
使用由能量转换装置部件构成的直接热路径散热，包括用于高强度打火和无线电力传输的垂直多功能光伏接收器的子部件

Direct Thermal Path Heat Sinking Using Fins Formed From Energy Conversion Device Components, Including Subcomponents of Vertical Multijunction Photovoltaic Receivers Used For High Intensity Beaming and Wireless Power Transmission
摘要：
New high energy operating regimes for high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for power beaming and wireless power transmission are made possible by new direct thermal pathways for heat sinking, where an energy conversion device comprises a plurality of fins [1] originating from inside the energy conversion device; [2] formed from an energy conversion device component; and where those fins [3] individually support traffic in energy carriers essential to the function of the energy conversion device. This allows high energy thermal interfacing and high intensity energy conversion, such as for receiving and transducing extremely high intensity light shined onto a small surface semiconductor device such as a vertical multijunction photovoltaic receiver. This allows high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for high intensity power beaming and wireless power transmission.
摘要（中）：

用于光束接收，信号采集和用于功率射束和无线功率传输的波束或信号生成的高强度能量传输的新的高能量操作方案由用于散热的新的直接热路径成为可能，其中能量转换装置包括多个 源自能量转换装置内的散热片[1] [2]由能量转换装置部件形成; 并且那些鳍[3]分别支持对能量转换装置的功能至关重要的能量载体的交通。 这允许高能量热接口和高强度能量转换，例如用于接收和转换照射到诸如垂直多结光伏接收器的小表面半导体器件上的极高强度的光。 这允许高强度能量传输用于波束接收，信号采集和用于高强度功率发射和无线功率传输的波束或信号生成。

信息查询
Global Dossier Espacenet
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L31/00 对红外辐射、光、较短波长的电磁辐射，或微粒辐射敏感的，并且专门适用于把这样的辐射能转换为电能的，或者专门适用于通过这样的辐射进行电能控制的半导体器件；专门适用于制造或处理这些半导体器件或其部件的方法或设备；其零部件（H01L51/42优先；由形成在一共用衬底内或其上的多个固态组件，而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00）
H01L31/04 .用作光伏〔PV〕转换器件（制造中其测试入H01L21/66；制造之后其测试入H02S50/10）
H01L31/052 ..与光伏电池直接联合或结合的冷却装置，例如，用于直接与光伏电池结合的主动冷却或散热器的Peltier元件（与光伏模块结合的冷却装置入H02S 40/42）
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