Intensity Selective Exposure Method And Apparatus
    2.
    发明申请
    Intensity Selective Exposure Method And Apparatus 有权
    强度选择性曝光方法和装置

    公开(公告)号:US20100261118A1

    公开(公告)日:2010-10-14

    申请号:US12421378

    申请日:2009-04-09

    IPC分类号: G03F7/20 G03B27/42

    CPC分类号: G03B27/42 G03F1/50 G03F7/203

    摘要: A gradated photomask is provided. The photomask includes a first region including a first plurality of sub-resolution features and a second region including a second plurality of sub-resolution features. The first region blocks a first percentage of the incident radiation. The second region blocks a second percentage of the incident radiation. The first and second percentage are different. An intensity selective exposure method is also provided.

    摘要翻译: 提供了分级光掩模。 光掩模包括包括第一多个子分辨率特征的第一区域和包括第二多个子分辨率特征的第二区域。 第一个区域阻止了第一个入射辐射的百分比。 第二个区域阻挡了入射辐射的第二个百分比。 第一和第二个百分比是不同的。 还提供强度选择性曝光方法。

    Intensity selective exposure method and apparatus
    6.
    发明授权
    Intensity selective exposure method and apparatus 有权
    强度选择性曝光方法和装置

    公开(公告)号:US08003303B2

    公开(公告)日:2011-08-23

    申请号:US12421378

    申请日:2009-04-09

    IPC分类号: G03F7/00 G03F1/00

    CPC分类号: G03B27/42 G03F1/50 G03F7/203

    摘要: A gradated photomask is provided. The photomask includes a first region including a first plurality of sub-resolution features and a second region including a second plurality of sub-resolution features. The first region blocks a first percentage of the incident radiation. The second region blocks a second percentage of the incident radiation. The first and second percentage are different. An intensity selective exposure method is also provided.

    摘要翻译: 提供了分级光掩模。 光掩模包括包括第一多个子分辨率特征的第一区域和包括第二多个子分辨率特征的第二区域。 第一个区域阻止了第一个入射辐射的百分比。 第二个区域阻挡了入射辐射的第二个百分比。 第一和第二个百分比是不同的。 还提供强度选择性曝光方法。

    Measurement of overlay offset in semiconductor processing
    7.
    发明授权
    Measurement of overlay offset in semiconductor processing 有权
    测量半导体加工中的覆盖偏移

    公开(公告)号:US07858404B2

    公开(公告)日:2010-12-28

    申请号:US11686078

    申请日:2007-03-14

    CPC分类号: H01L22/12 G03F7/70633

    摘要: A method of semiconductor manufacturing including forming an overlay offset measurement target including a first feature on a first layer and a second feature on a second layer. The first feature and the second feature have a first predetermined overlay offset. The target is irradiated. The reflectivity of the irradiated target is determined. An overlay offset for the first layer and the second layer is calculated using the determined reflectivity.

    摘要翻译: 一种半导体制造方法,包括在第一层上形成包括第一特征的覆盖偏移测量目标,在第二层上形成第二特征。 第一特征和第二特征具有第一预定覆盖偏移。 目标被照射。 确定照射的靶的反射率。 使用确定的反射率计算第一层和第二层的覆盖偏移。

    System and method for alignment in semiconductor device fabrication
    9.
    发明授权
    System and method for alignment in semiconductor device fabrication 有权
    用于在半导体器件制造中对准的系统和方法

    公开(公告)号:US08837810B2

    公开(公告)日:2014-09-16

    申请号:US13431668

    申请日:2012-03-27

    IPC分类号: G06K9/68

    摘要: A method of determining overlay error in semiconductor device fabrication includes receiving an image of an overlay mark formed on a substrate. The received image is separated into a first image and a second image, where the first image includes representations of features formed on a first layer of the substrate and the second image includes representations of the features formed on a second layer of the substrate. A quality indicator is determined for the first image and a quality indicator is determined for the second image. In an embodiment, the quality indicators include asymmetry indexes.

    摘要翻译: 确定半导体器件制造中的覆盖误差的方法包括接收形成在衬底上的覆盖标记的图像。 所接收的图像被分成第一图像和第二图像,其中第一图像包括形成在基底的第一层上的特征的表示,并且第二图像包括形成在基底的第二层上的特征的表示。 确定第一个图像的质量指示符,并确定第二个图像的质量指示符。 在一个实施例中,质量指标包括不对称指数。

    SYSTEM AND METHOD FOR ALIGNMENT IN SEMICONDUCTOR DEVICE FABRICATION
    10.
    发明申请
    SYSTEM AND METHOD FOR ALIGNMENT IN SEMICONDUCTOR DEVICE FABRICATION 有权
    用于在半导体器件制造中对准的系统和方法

    公开(公告)号:US20130259358A1

    公开(公告)日:2013-10-03

    申请号:US13431668

    申请日:2012-03-27

    IPC分类号: G06K9/68

    摘要: A method of determining overlay error in semiconductor device fabrication includes receiving an image of an overlay mark formed on a substrate. The received image is separated into a first image and a second image, where the first image includes representations of features formed on a first layer of the substrate and the second image includes representations of the features formed on a second layer of the substrate. A quality indicator is determined for the first image and a quality indicator is determined for the second image. In an embodiment, the quality indicators include asymmetry indexes

    摘要翻译: 确定半导体器件制造中的覆盖误差的方法包括接收形成在衬底上的覆盖标记的图像。 所接收的图像被分成第一图像和第二图像,其中第一图像包括形成在基底的第一层上的特征的表示,并且第二图像包括形成在基底的第二层上的特征的表示。 确定第一个图像的质量指示符,并确定第二个图像的质量指示符。 在一个实施例中,质量指标包括不对称指数