Invention Application
US20160011144A1 Backside CMOS Compatible BioFET With No Plasma Induced Damage 审中-公开
背面CMOS兼容的BioFET,无等离子体诱发损伤

Backside CMOS Compatible BioFET With No Plasma Induced Damage
Abstract:
The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
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