Invention Application
US20160011144A1 Backside CMOS Compatible BioFET With No Plasma Induced Damage
审中-公开
背面CMOS兼容的BioFET,无等离子体诱发损伤
- Patent Title: Backside CMOS Compatible BioFET With No Plasma Induced Damage
- Patent Title (中): 背面CMOS兼容的BioFET,无等离子体诱发损伤
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Application No.: US14799453Application Date: 2015-07-14
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Publication No.: US20160011144A1Publication Date: 2016-01-14
- Inventor: Yi-Shao Liu , Chun-Ren Cheng , Ching-Ray Chen , Yi-Hsien Chang , Fei-Lung Lai , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: G01N27/414
- IPC: G01N27/414 ; H01L21/311 ; H01L29/66

Abstract:
The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
Public/Granted literature
- US09709525B2 Backside CMOS compatible BioFET with no plasma induced damage Public/Granted day:2017-07-18
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