Invention Application
- Patent Title: INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP
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Application No.: US14864191Application Date: 2015-09-24
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Publication No.: US20160012952A1Publication Date: 2016-01-14
- Inventor: Hanyi Ding , Anthony K. Stamper
- Applicant: GLOBALFOUNDRIES Inc.
- Main IPC: H01F27/00
- IPC: H01F27/00 ; H01F27/28

Abstract:
Various embodiments include inductor structures including at least one air gap for reducing capacitance between windings in the inductor structure. One embodiment includes an inductor structure having: a substrate; an insulation layer overlying the substrate; a conductive winding overlying the substrate within the insulation layer, the conductive winding wrapped around itself to form a plurality of turns substantially concentric about a central axis; an insulating structural support containing an air gap between the conductive winding and the insulation layer, the insulating structural support at least one of under, over or surrounding the plurality of turns of the conductive winding or between adjacent turns in the conductive winding; and at least one insulation pocket located radially inside a radially innermost turn in the plurality of turns with respect to the central axis.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F27/00 | 变压器或电感器的一般零部件 |