Invention Application
- Patent Title: LASER SUBMOUNTS FORMED USING ETCHING PROCESS
-
Application No.: US14862967Application Date: 2015-09-23
-
Publication No.: US20160013615A1Publication Date: 2016-01-14
- Inventor: Roger L. Hipwell , Dadi Setiadi
- Applicant: Seagate Technology LLC
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01S5/02
Abstract:
A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.
Public/Granted literature
- US09502857B2 Laser submounts formed using etching process Public/Granted day:2016-11-22
Information query
