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1.发明授权公开(公告)号：US08873348B2
公开(公告)日：2014-10-28
申请号：US14097482
申请日：2013-12-05
CPC分类号： G11B5/127 , G11B5/105 , G11B5/314 , G11B2005/0021
摘要： A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
摘要翻译： 写头包括被配置为将激光二极管耦合到写入头的腔。 空腔的底部包括被配置为接触激光二极管的导热元件，设置在导热元件下方的多个热钉，以及设置在热钉之下的基底。 导热元件，热螺柱和基板被热耦合以从激光二极管吸取热量。
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公开(公告)号：US09202489B2
公开(公告)日：2015-12-01
申请号：US14163632
申请日：2014-01-24
发明人： Nils Gokemeijer , Edward Charles Gage , Roger L. Hipwell , Michael Christopher Kautzky , Scott Eugene Olson
CPC分类号： G11B5/4866 , G11B5/105 , G11B5/6088 , G11B2005/0021
摘要： An apparatus that includes a slider having a mounting surface, the mounting surface opposite a media-facing surface of the slider. The apparatus includes a laser diode mounted on a side surface to the mounting surface. The laser diode has an active region of the laser diode is disposed substantially perpendicular to the mounting surface.
摘要翻译： 一种装置，包括具有安装表面的滑块，所述安装表面与所述滑块的面向介质的表面相对。 该装置包括安装在安装表面的侧表面上的激光二极管。 激光二极管具有基本上垂直于安装表面设置的激光二极管的有源区。
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公开(公告)号：US08767351B1
公开(公告)日：2014-07-01
申请号：US13755175
申请日：2013-01-31
发明人： Leping Li , Saravuth Keo , Kara L. Maytag , Pramit P. Parikh , Jeff R. O'Konski , Mark A. Herendeen , Joel W. Hoehn , Roger L. Hipwell , Joe J. Schobel , John L. Ibele , Ralph Marquart , Edward Knutson
IPC分类号： G11B5/48
CPC分类号： G11B5/102 , G11B5/3169 , G11B5/3173 , G11B5/4826 , G11B2005/0021 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48463 , H01L2224/48644 , H01L2224/85012 , H01L2224/85099 , H01L2224/85205 , H01L2924/12042 , H01L2924/20751 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/20308 , H01L2924/20309 , H01L2924/20752 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.
摘要翻译： 目前公开的技术描述了使用超过千分之一英寸直径的金线使用超声波接合能量并且不加热下面的焊盘来获得球接合的系统和方法。 球接合允许使用特别接近相邻微电子结构的特别小的接合焊盘，其限制了具有浅起飞角的其它接合技术的使用。
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公开(公告)号：US20160013615A1
公开(公告)日：2016-01-14
申请号：US14862967
申请日：2015-09-23
发明人： Roger L. Hipwell , Dadi Setiadi
CPC分类号： H01S5/02268 , G11B5/105 , G11B5/3173 , G11B2005/0021 , H01L21/6836 , H01L21/78 , H01S5/0201 , H01S5/02236 , H01S5/02252 , H01S5/0226 , H01S5/02272
摘要： A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.
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公开(公告)号：US20150213819A1
公开(公告)日：2015-07-30
申请号：US14163632
申请日：2014-01-24
发明人： Nils Gokemeijer , Edward Charles Gage , Roger L. Hipwell , Michael Christopher Kautzky , Scott Eugene Olson
IPC分类号： G11B5/48
CPC分类号： G11B5/4866 , G11B5/105 , G11B5/6088 , G11B2005/0021
摘要： An apparatus that includes a slider having a mounting surface, the mounting surface opposite a media-facing surface of the slider. The apparatus includes a laser diode mounted on a side surface to the mounting surface. The laser diode has an active region of the laser diode is disposed substantially perpendicular to the mounting surface.
摘要翻译： 一种装置，包括具有安装表面的滑块，所述安装表面与所述滑块的面向介质的表面相对。 该装置包括安装在安装表面的侧表面上的激光二极管。 激光二极管具有基本上垂直于安装表面设置的激光二极管的有源区。
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6.发明申请公开(公告)号：US20140091130A1
公开(公告)日：2014-04-03
申请号：US14097482
申请日：2013-12-05
IPC分类号： G11B5/127
CPC分类号： G11B5/127 , G11B5/105 , G11B5/314 , G11B2005/0021
摘要： A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
摘要翻译： 写头包括被配置为将激光二极管耦合到写入头的腔。 空腔的底部包括被配置为接触激光二极管的导热元件，设置在导热元件下方的多个热钉，以及设置在热钉之下的基底。 热传导元件，热螺柱和基板被热耦合以从激光二极管吸取热量。
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