Invention Application
US20160020147A1 IMPEDANCE MATCHING CIRCUIT, POWER AMPLIFIER AND MANUFACTURING METHOD FOR VARIABLE CAPACITOR
审中-公开
阻抗匹配电路,功率放大器和可变电容器的制造方法
- Patent Title: IMPEDANCE MATCHING CIRCUIT, POWER AMPLIFIER AND MANUFACTURING METHOD FOR VARIABLE CAPACITOR
- Patent Title (中): 阻抗匹配电路,功率放大器和可变电容器的制造方法
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Application No.: US14862123Application Date: 2015-09-22
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Publication No.: US20160020147A1Publication Date: 2016-01-21
- Inventor: Jongmin LEE , Byoung-Gue MIN , Seong-il KIM , Hyung Sup YOON , Jae Kyoung MUN , Eun Soo NAM
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2012-0015292 20120215
- Main IPC: H01L21/8222
- IPC: H01L21/8222 ; H01L27/06

Abstract:
A manufacturing method for a variable capacitor includes forming a first element of which a capacitance value depends on a voltage applied to both of two terminals of a first area on a substrate, forming a second element having a capacitance value fixed to a second area on the substrate adjacent to the first area, and forming metallic wires for connecting the first element and the second element and connecting the first element and the second element with the outside. The first element maybe a bipolar transistor that may include a diode. The second element maybe a capacitor that includes a dielectric.
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