Invention Application
- Patent Title: Vacuum Pump
- Patent Title (中): 真空泵
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Application No.: US14763345Application Date: 2013-12-25
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Publication No.: US20160025096A1Publication Date: 2016-01-28
- Inventor: Yongwei Shi , Manabu Nonaka , Yoshinobu Ohtachi , Yasushi Maejima , Tsutomu Takaada
- Applicant: EDWARDS JAPAN LIMITED
- Priority: JP2013-017234 20130131; JP2013-025936 20130213
- International Application: PCT/JP2013/084634 WO 20131225
- Main IPC: F04D19/00
- IPC: F04D19/00 ; F04D29/053 ; F04D29/40 ; F04D29/32 ; F04D25/06 ; F04D29/58

Abstract:
An object is to reduce an adhesion amount of a product in a vacuum pump as a whole and effectively prevent occurrence of a trouble in a vacuum pump electric system due to a magnetic flux leak. A vacuum pump includes a rotor enclosed in a pump case, a rotating shaft fixed to the rotor, a supporting means that rotatably supports the rotating shaft, a driving means that rotates the rotating shaft, and thread-groove-exhaust-portion stators that form thread grove exhaust passages between the thread-groove-exhaust-portion stator and an outer circumferential side of or an inner circumferential side of the rotor. A heating portion is provided below the thread-groove-exhaust-portion stators. The heating portion includes a yoke, a coil, and a heating plate. The heating portion heats the yoke and the heating plate with electromagnetic induction heating by feeding an alternating current to the coil.
Public/Granted literature
- US10364814B2 Vacuum pump Public/Granted day:2019-07-30
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