Invention Application
- Patent Title: INTERFACE CIRCUIT AND PACKET TRANSMISSION METHOD THEREOF
- Patent Title (中): 接口电路和分组传输方法
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Application No.: US14697815Application Date: 2015-04-28
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Publication No.: US20160041936A1Publication Date: 2016-02-11
- Inventor: Eunji LEE , Junghyo WOO
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0102427 20140808
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F12/08 ; G06F13/42

Abstract:
A packet transmission method includes packaging a plurality of data in the form of a payload; storing information on whether the plurality of data are packaged in a header, the payload or a CRC area including a transmission error check code of the plurality of data; combining the header, the payload, and the CRC area with each other to generate a transaction layer packet; and outputting a packet including the transaction layer packet.
Public/Granted literature
- US10185687B2 Interface circuit and packet transmission method thereof Public/Granted day:2019-01-22
Information query