Invention Application
- Patent Title: CHIP ELECTRONIC COMPONENT
- Patent Title (中): 芯片电子元件
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Application No.: US14692696Application Date: 2015-04-21
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Publication No.: US20160042859A1Publication Date: 2016-02-11
- Inventor: Moon Soo PARK , Jong Ho LEE , Dong Hwan LEE , Jin Ok HAN , Tae Young KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0103945 20140811
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/255

Abstract:
There is provided a chip electronic component including: a magnetic body having an internal coil part embedded therein, wherein the magnetic body includes: a central portion provided inside of the internal coil part and including a core; and an outer peripheral portion provided outside of the central portion, the central portion and the outer peripheral portion having different magnetic permeabilities.
Public/Granted literature
- US09905349B2 Chip electronic component Public/Granted day:2018-02-27
Information query