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公开(公告)号:US20150253909A1
公开(公告)日:2015-09-10
申请号:US14341096
申请日:2014-07-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Gyu Seok KIM , Hee Suk CHUNG , Dong Yong KIM , Dek Gin YANG , Mi Yang KIM , Tae Young KIM
IPC: G06F3/047
CPC classification number: G06F3/047
Abstract: Embodiments of the invention provide a touch sensor including a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern is formed by continuously connecting one or more unit patterns, and each unit pattern has closed figures formed to be irregularly arranged therein.
Abstract translation: 本发明的实施例提供一种触摸传感器,其包括基底基板和形成在基底基板上的电极图案。 电极图案通过连续地连接一个或多个单元图案而形成,并且每个单元图案具有形成为不规则地布置在其中的封闭图形。
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公开(公告)号:US20150227238A1
公开(公告)日:2015-08-13
申请号:US14619031
申请日:2015-02-10
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Tae Young KIM , Victor Yurlov , Sang Hwan Oh , Yoon Mi O
IPC: G06F3/044
CPC classification number: G06F3/044 , G06F2203/04112
Abstract: A touch sensor may comprise a base substrate and an electrode pattern formed on one surface of the base substrate. The electrode pattern may be formed of a mesh pattern including a plurality of unit mesh patterns. Each of the unit mesh patterns may be formed in a rectangular shape including first and second sides facing each other. An acute angle θ1, formed by a horizontal line passing through a central point of the unit mesh pattern and the first side, and an acute angle θ2, formed by the horizontal line passing through the central point of the unit mesh pattern and the second side, may be different from each other.
Abstract translation: 触摸传感器可以包括基底基板和形成在基底基板的一个表面上的电极图案。 电极图案可以由包括多个单位网格图案的网格图案形成。 每个单位网格图案可以形成为包括彼此面对的第一和第二侧面的矩形形状。 锐角和角度; 1,由穿过单位网格图案和第一侧的中心点的水平线形成,并且具有锐角和角度; 2,由穿过单位网格图案的中心点的水平线形成 并且第二面可以彼此不同。
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公开(公告)号:US20180148854A1
公开(公告)日:2018-05-31
申请号:US15881296
申请日:2018-01-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Yeon CHA , Dong Hwan LEE , Jung Hyuk JUNG , Chan Yoon , Hye Min Bang , Tae Young KIM
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
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4.
公开(公告)号:US20150270053A1
公开(公告)日:2015-09-24
申请号:US14485402
申请日:2014-09-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Yeon CHA , Dong Hwan LEE , Jung Hyuk JUNG , Chan YOON , Hye Min BANG , Tae Young KIM
CPC classification number: C25D7/001 , C25D5/02 , C25D5/10 , C25D5/16 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/046
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
Abstract translation: 提供了一种芯片电子部件及其制造方法,更具体地,涉及一种具有能够防止线圈部分之间发生短路并具有高纵横比(AR)的内部线圈结构的芯片电子部件,通过增加 与线圈的宽度相比,线圈的厚度及其制造方法。
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公开(公告)号:US20150048915A1
公开(公告)日:2015-02-19
申请号:US14459172
申请日:2014-08-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Chan YOON , Dong Hwan LEE , Tae Young KIM
CPC classification number: H01F27/292 , H01F17/0013 , H01F2017/0066
Abstract: A chip electronic component may include: a magnetic body including an insulating substrate; internal conductive pattern parts disposed on at least one surface of the insulating substrate; external electrodes disposed on the magnetic body and connected to the internal conductive pattern parts; and an additional magnetic layer disposed on a bottom surface of the magnetic body and covering portions of the external electrodes disposed on the bottom surface of the magnetic body.
Abstract translation: 芯片电子部件可以包括:包括绝缘基板的磁体; 设置在所述绝缘基板的至少一个表面上的内部导电图形部分; 设置在磁体上并连接到内部导电图案部分的外部电极; 以及设置在磁体的底面上并覆盖设置在磁性体的底面上的外部电极的部分的附加磁性层。
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6.
公开(公告)号:US20170047160A1
公开(公告)日:2017-02-16
申请号:US15339622
申请日:2016-10-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Sung Hee KIM , Tae Young KIM , Myoung Soon PARK , Sung Hyun KIM , Hye Yeon CHA
CPC classification number: H01F27/327 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/042 , H01F41/046 , H01F41/127 , H01F2017/048
Abstract: The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.
Abstract translation: 本申请提供了一种芯片电子部件及其制造方法。 更具体地,提供了一种芯片电子部件,其包括具有减小的宽度的薄绝缘膜,并且延伸到线圈图案的下部,而不暴露线圈图案,使得线圈图案不与磁性材料直接接触,由此 防止高频波形较差,增加电感。
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公开(公告)号:US20160086714A1
公开(公告)日:2016-03-24
申请号:US14686651
申请日:2015-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Je Ik MOON , Sung Soo KIM , Tae Young KIM , Ye Eun JEONG , Jong Hun KIM , Seong Min CHIN
IPC: H01F27/255 , H01F27/33 , H01F27/28
CPC classification number: H01F27/255 , H01F17/0013 , H01F27/2804 , H01F27/292 , H01F2017/048 , H01F2027/2809
Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.
Abstract translation: 提供了一种芯片电子部件,包括:包含磁性金属粉末颗粒和热固性树脂的磁体; 嵌入在磁体内的内部线圈部分; 以及涂覆有磁体表面的表面保护层。 表面保护层可以防止在形成外部电极时在芯片电子部件的表面上发生的电镀扩展现象。
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公开(公告)号:US20160042859A1
公开(公告)日:2016-02-11
申请号:US14692696
申请日:2015-04-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Moon Soo PARK , Jong Ho LEE , Dong Hwan LEE , Jin Ok HAN , Tae Young KIM
IPC: H01F27/28 , H01F27/255
CPC classification number: H01F17/04 , H01F17/0013 , H01F27/02 , H01F2003/106 , H01F2017/048
Abstract: There is provided a chip electronic component including: a magnetic body having an internal coil part embedded therein, wherein the magnetic body includes: a central portion provided inside of the internal coil part and including a core; and an outer peripheral portion provided outside of the central portion, the central portion and the outer peripheral portion having different magnetic permeabilities.
Abstract translation: 提供了一种芯片电子部件,包括:具有嵌入其中的内部线圈部分的磁体,其中所述磁体包括:设置在所述内部线圈部分内部并包括芯的中心部分; 以及设置在中央部外侧的外周部,中央部和外周部具有不同的磁导率。
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公开(公告)号:US20150248186A1
公开(公告)日:2015-09-03
申请号:US14266260
申请日:2014-04-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Sang Hwan OH , Yoon Mi O , Tae Young KIM
CPC classification number: G06F3/047 , G06F3/044 , G06F2203/04112
Abstract: There is provided a touch panel including: a substrate; an electrode part including a plurality of electrodes formed on one surface of the substrate and formed of conductive lines having a mesh pattern; and a pad part including a plurality of pads connected to end portions of the plurality of electrodes and formed of conductive lines having a mesh pattern, wherein the conductive lines of the plurality of pads and the conductive lines of the plurality of electrodes may have the same line width.
Abstract translation: 提供了一种触摸面板,包括:基板; 电极部,其包括形成在所述基板的一个表面上并由具有网状图案的导线形成的多个电极; 以及焊盘部分,其包括连接到所述多个电极的端部并由具有网状图案的导线形成的多个焊盘,其中所述多个焊盘中的导线和所述多个电极中的导电线可以具有相同的 行宽。
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10.
公开(公告)号:US20150109088A1
公开(公告)日:2015-04-23
申请号:US14516151
申请日:2014-10-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Sung Hyun KIM , Myoung Soon PARK , Sung Hee KIM , Tae Young KIM , Hye Yeon CHA
CPC classification number: H01F41/12 , H01F17/0013 , H01F2017/0066 , H01F2017/048
Abstract: A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.
Abstract translation: 芯片电子部件可以包括:具有嵌入其中的线圈导电图案部分的磁体; 以及形成在所述线圈导电图案部分的表面上的氧化物绝缘膜。 即使在绝缘膜形成得比绝缘膜薄的情况下,也可以防止线圈导电图案部分露出,由此磁性材料和线圈导电图案部分可能不会彼此接触。 因此,可以高频地防止波形缺陷。
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