Invention Application
- Patent Title: PACKAGE STRUCTURE
- Patent Title (中): 包装结构
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Application No.: US14919744Application Date: 2015-10-22
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Publication No.: US20160043239A1Publication Date: 2016-02-11
- Inventor: Hsiang-Hung Chang , Wen-Chih Chen , Chia-Wei Jui , Zhi-Cheng Hsiao , Cheng-Ta Ko , Rong-Shen Lee , Sheng-Shu Yang
- Applicant: Industrial Technology Research Institute
- Priority: TW102111720 20130401; TW103131187 20140910
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/0203
Abstract:
Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.
Information query
IPC分类:
