公开(公告)号：US10458893B2

公开(公告)日：2019-10-29

申请号：US15245199

申请日：2016-08-24

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin ,  Hsiang-Hung Chang ,  Wen-Chih Chen

IPC: G01N15/06 ,  G01N15/00

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

公开(公告)号：US20170052103A1

公开(公告)日：2017-02-23

申请号：US15245199

申请日：2016-08-24

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin ,  Hsiang-Hung Chang ,  Wen-Chih Chen

IPC: G01N15/06

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

Abstract translation: 提供一种包括过滤器和浓度检测器的微型颗粒物检测器。 过滤器具有多个孔，并且浓度检测器相应地设置在过滤器下方。 浓度检测器具有用于检测至少一种小型化颗粒物质的浓度的检测区域。 还提供了一种过滤器的制造方法。

公开(公告)号：US09373564B2

公开(公告)日：2016-06-21

申请号：US14640028

申请日：2015-03-06

Applicant: Industrial Technology Research Institute

Inventor： Wen-Wei Shen ,  Kuan-Neng Chen ,  Cheng-Ta Ko

IPC: H01L29/40 ,  H01L23/48 ,  H01L21/768 ,  H01L25/065

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0347 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/11002 ,  H01L2224/11462 ,  H01L2224/11602 ,  H01L2224/13009 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/16014 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device includes a substrate, a redistribution layer, a plurality of through-silicon vias (TSVs), and a plating seed layer. The substrate has a first surface and a second surface opposite to each other, and a plurality of cavities. The redistribution layer is disposed on the first surface, and the TSVs are respectively disposed in the cavities. The plating seed layer is disposed between the inner wall of each of the cavities and the corresponding TSVs. The anti-oxidation layer is disposed between the plating seed layer and the corresponding TSVs. The buffer layer covers the first surface and exposes the redistribution layers. Furthermore, a manufacturing method and a stacking structure of the semiconductor device are also provided.

Abstract translation: 半导体器件包括衬底，再分布层，多个穿硅通孔（TSV）和电镀种子层。 基板具有彼此相对的第一表面和第二表面，以及多个空腔。 再分配层设置在第一表面上，并且TSV分别设置在空腔中。 电镀种子层设置在每个空腔的内壁和相应的TSV之间。 抗氧化层设置在电镀种子层和相应的TSV之间。 缓冲层覆盖第一表面并暴露再分布层。 此外，还提供了半导体器件的制造方法和堆叠结构。

公开(公告)号：US09130080B2

公开(公告)日：2015-09-08

申请号：US13943810

申请日：2013-07-17

Applicant: Industrial Technology Research Institute

Inventor： Zhi-Cheng Hsiao ,  Ming-Ji Dai ,  Cheng-Ta Ko

IPC: H01L31/024 ,  H01L27/146

CPC classification number: H01L31/024 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.

Abstract translation: 提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。 背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。 导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。 散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。

公开(公告)号：US10121673B2

公开(公告)日：2018-11-06

申请号：US14953424

申请日：2015-11-30

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin

IPC: H01L21/306 ,  G01N29/02 ,  G01N29/036 ,  G01N15/00 ,  G01N15/06

Abstract: In an embodiment, a miniaturize particulate matter detector includes a filter having a plurality of holes, and a concentration detector correspondingly disposed under the filter. The concentration detector has a detect area used for detecting a concentration of at least one miniaturize particulate matter. A manufacturing method of the filter is also provided.

公开(公告)号：US20160043018A1

公开(公告)日：2016-02-11

申请号：US14640028

申请日：2015-03-06

Applicant: Industrial Technology Research Institute

Inventor： Wen-Wei Shen ,  Kuan-Neng Chen ,  Cheng-Ta Ko

IPC: H01L23/48 ,  H01L25/065 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0347 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/11002 ,  H01L2224/11462 ,  H01L2224/11602 ,  H01L2224/13009 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/16014 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device includes a substrate, a redistribution layer, a plurality of through-silicon vias (TSVs), and a plating seed layer. The substrate has a first surface and a second surface opposite to each other, and a plurality of cavities. The redistribution layer is disposed on the first surface, and the TSVs are respectively disposed in the cavities. The plating seed layer is disposed between the inner wall of each of the cavities and the corresponding TSVs. The anti-oxidation layer is disposed between the plating seed layer and the corresponding TSVs. The buffer layer covers the first surface and exposes the redistribution layers. Furthermore, a manufacturing method and a stacking structure of the semiconductor device are also provided.

Abstract translation: 半导体器件包括衬底，再分布层，多个穿硅通孔（TSV）和电镀种子层。 基板具有彼此相对的第一表面和第二表面，以及多个空腔。 再分配层设置在第一表面上，并且TSV分别设置在空腔中。 电镀种子层设置在每个空腔的内壁和相应的TSV之间。 抗氧化层设置在电镀种子层和相应的TSV之间。 缓冲层覆盖第一表面并暴露再分布层。 此外，还提供了半导体器件的制造方法和堆叠结构。

公开(公告)号：US20140291790A1

公开(公告)日：2014-10-02

申请号：US13943810

申请日：2013-07-17

Applicant: Industrial Technology Research Institute

Inventor： Zhi-Cheng Hsiao ,  Ming-Ji Dai ,  Cheng-Ta Ko

IPC: H01L31/024 ,  H01L27/146

CPC classification number: H01L31/024 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.

Abstract translation: 提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。 背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。 导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。 散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。

公开(公告)号：US20170153214A1

公开(公告)日：2017-06-01

申请号：US14952924

申请日：2015-11-26

Applicant: Industrial Technology Research Institute

Inventor： Chin-Hung Wang ,  Cheng-Ta Ko ,  Sheng-Shu Yang

IPC: G01N33/00 ,  G01N21/27 ,  G01N21/25

CPC classification number: G01N33/0062 ,  G01J3/0208 ,  G01J3/0259 ,  G01J3/0286 ,  G01J3/18 ,  G01J2003/1852 ,  G01N21/255 ,  G01N21/31 ,  G01N33/0013 ,  G01N33/0027

Abstract: An optical sensing module, adapted to sense a characteristic of an object by a sensing beam, comprises a carrying substrate, a transparent cover having a reflective surface thereon, a side wall, an optical grating, and an optical sensor. The reflective surface has a light-transmissive opening that exposes a part of the transparent cover. The side wall is disposed around the carrying substrate and is located between the carrying substrate and the transparent cover. The optical grating is disposed on the carrying substrate and a position of the optical grating corresponds to the light-transmissive opening. The optical sensor is disposed on the carrying substrate and is located at a side of the optical grating, wherein the carrying substrate, the side wall and the transparent cover form a vacuum chamber. The optical grating and the optical sensor are disposed in the vacuum chamber.

公开(公告)号：US20170052102A1

公开(公告)日：2017-02-23

申请号：US14953424

申请日：2015-11-30

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin

IPC: G01N15/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/768

CPC classification number: H01L21/30604 ,  G01N15/0606 ,  G01N29/022 ,  G01N29/036 ,  G01N2015/0046 ,  G01N2291/014 ,  G01N2291/02809

Abstract: In an embodiment, a miniaturize particulate matter detector includes a filter having a plurality of holes, and a concentration detector correspondingly disposed under the filter. The concentration detector has a detect area used for detecting a concentration of at least one miniaturize particulate matter. A manufacturing method of the filter is also provided.

Abstract translation: 在一个实施例中，小型化颗粒物质检测器包括具有多个孔的过滤器和相应地设置在过滤器下方的浓度检测器。 浓度检测器具有用于检测至少一种小型化颗粒物质的浓度的检测区域。 还提供了一种过滤器的制造方法。

公开(公告)号：US20160043239A1

公开(公告)日：2016-02-11

申请号：US14919744

申请日：2015-10-22

Applicant: Industrial Technology Research Institute

Inventor： Hsiang-Hung Chang ,  Wen-Chih Chen ,  Chia-Wei Jui ,  Zhi-Cheng Hsiao ,  Cheng-Ta Ko ,  Rong-Shen Lee ,  Sheng-Shu Yang

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L23/481 ,  H01L24/09 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/05009

Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.

Abstract translation: 提供适用于层叠半导体器件封装的导电插塞结构，其中可以实现导电插塞结构和相应的器件焊盘之间的大的接触区域，以减少电阻抗。 因此，使用导电插塞结构的诸如光敏器件封装的封装结构具有优异的电性能和可靠性。