Invention Application
US20160043239A1 PACKAGE STRUCTURE 审中-公开
包装结构

PACKAGE STRUCTURE
Abstract:
Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.
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